Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
73770-1109
|
122Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise VerticalSMC, Closed End Option, 144 Circuits
|
73770-1200
|
132Kb/3P |
2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 144 Circuits
|
73770-1300
|
132Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise VerticalSMC, Closed End Option, 144 Circuits
|
73770-1309
|
122Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed EndOption, 144 Circuits
|
MolexKits |
73770-0100
|
47Kb/6P |
Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm
|
Molex Electronics Ltd. |
73770-0100
|
131Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits
|
73770-0200
|
131Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise VerticalSMC, Closed End Option, 72 Circuits
|
73770-0300
|
131Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits
|
ebm-papst |
73770-2-3634
|
1Mb/5P |
M4Q Series
|