| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
87758-2616
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2617
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.76um (30u") Gold (Au) Selective Plating
|
|
87758-2016
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2017
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2050
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits
|
|
87758-2216
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38um (15u") Gold (Au) Selective Plating
|
|
87758-2217
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 22 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2250
|
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-2416
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.38關m 15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2417
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2450
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits
|
|
87758-2816
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2817
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-2850
|
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0014
|
195Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0216
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 2 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0217
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u") Gold (Au) Selective Plating
|
|
87758-0416
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0417
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0450
|
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
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