| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
87758-3816
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3850
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-3016
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3017
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3050
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 30 Circuits
|
|
87758-3216
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 32 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3217
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3250
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits
|
|
87758-3416
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3417
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3450
|
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 34 Circuits, 0.38um (15u") Gold (Au) Selective Plating
|
|
87758-3616
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits
|
|
87758-3617
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 36 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-3650
|
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 36 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0014
|
195Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
87758-0216
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 2 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0217
|
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u") Gold (Au) Selective Plating
|
|
87758-0416
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0417
|
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
87758-0450
|
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
|
German ▼ 
English
Chinese
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand