The part number **02015K8R2ABSTR** refers to a high-precision, thin-film surface mount capacitor manufactured by **AVX (Kyocera AVX)**. This component is part of the **Accu-P®** series, specifically designed for high-frequency (RF/Microwave) applications. --- ### 1. Component Specifications The part number can be decoded to understand its electrical and physical characteristics: | Feature | Specification | Description | | :--- | :--- | :--- | | **Case Size** | 0201 | Ultra-miniature (0.60mm x 0.30mm) | | **Voltage Rating** | 50V | Maximum DC working voltage | | **Dielectric** | K | Specialized RF Thin Film material | | **Capacitance** | 8.2 pF | 8R2 represents 8.2 picofarads | | **Tolerance** | ±0.05 pF | Letter "A" denotes ultra-tight tolerance | | **Termination** | B | Nickel / Solder (Sn/Pb) | | **Packaging** | TR | Tape and Reel (Standard for automated assembly) | --- ### 2. Key Technical Features * **Thin-Film Technology:** Unlike standard multilayer ceramic capacitors (MLCCs), thin-film capacitors are manufactured using a process similar to semiconductors. This results in extremely precise dimensions and electrical properties. * **High Q Factor:** Offers very low ESR (Equivalent Series Resistance) at high frequencies, meaning minimal energy loss. * **SRF (Self-Resonant Frequency):** Due to its 0201 size and thin-film construction, it has a very high SRF, making it functional well into the Gigahertz (GHz) range. * **Stability:** High stability over temperature and frequency, which is critical for filter and matching circuits. --- ### 3. Common Applications This specific capacitor is typically used in sensitive RF circuitry where precision is mandatory: 1. **Mobile Communications:** Smartphones and tablets (5G/LTE bands). 2. **Satellite Receivers:** High-frequency LNBs and signal processing. 3. **GPS/Navigation:** Precision timing and filtering. 4. **Medical Equipment:** High-frequency imaging and wireless telemetry. 5. **RF Matching Networks:** Impedance matching for antennas and power amplifiers. --- ### 4. Handling & Assembly Note Due to the **0201** package size, this part is extremely small (roughly the size of a speck of dust). It requires: * High-precision pick-and-place machinery. * Automated Optical Inspection (AOI) for quality control. * Strict solder profile management to prevent "tombstoning" (the component standing upright during reflow).