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  • ATS-02A-151-C2-R0

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    The **ATS-02A-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The table below summarizes the core physical and thermal properties of the part: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Style** | Straight | | **Thermal Resistance** | 3.93 °C/W (at 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. This heat sink is designed for **forced convection** (airflow). The straight-fin design allows air to pass through with low pressure drop, making it ideal for systems with standard cooling fans. #### B. Attachment Mechanism (pushPIN™) Instead of adhesive or simple clips, this model uses a spring-loaded push-pin system. This provides: * **Constant Pressure:** Ensures the heat sink maintains firm contact with the component for optimal heat transfer. * **Easy Installation:** Simplifies the assembly process on the PCB. * **Reliability:** Resistant to vibration and mechanical shock. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **02** | pushPIN™ Attachment type | | **A** | Aluminum material | | **151** | Specific size/designator for the 35mm series | | **C2** | Thermal performance/Coating specification | | **R0** | RoHS compliance / Revision status | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ How does the thermal resistance change at higher airflow speeds?
    • ⤷ Is this heat sink compatible with standard 35mm x 35mm BGA packages?