ATS-02A-151-C2-R0
AI

The **ATS-02A-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The table below summarizes the core physical and thermal properties of the part:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 20mm |
| **Fin Style** | Straight |
| **Thermal Resistance** | 3.93 °C/W (at 1.0 m/s airflow) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Electronic & Mechanical Features
#### A. Thermal Performance
The "C2" in the part number indicates a specific thermal profile. This heat sink is designed for **forced convection** (airflow). The straight-fin design allows air to pass through with low pressure drop, making it ideal for systems with standard cooling fans.
#### B. Attachment Mechanism (pushPIN™)
Instead of adhesive or simple clips, this model uses a spring-loaded push-pin system. This provides:
* **Constant Pressure:** Ensures the heat sink maintains firm contact with the component for optimal heat transfer.
* **Easy Installation:** Simplifies the assembly process on the PCB.
* **Reliability:** Resistant to vibration and mechanical shock.
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **02** | pushPIN™ Attachment type |
| **A** | Aluminum material |
| **151** | Specific size/designator for the 35mm series |
| **C2** | Thermal performance/Coating specification |
| **R0** | RoHS compliance / Revision status |
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- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ How does the thermal resistance change at higher airflow speeds?
- ⤷ Is this heat sink compatible with standard 35mm x 35mm BGA packages?