The **ATS-03G-110-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and power modules that utilize a "Push-Pin" mounting mechanism. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 2.69°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 54mm x 54mm x 25mm | | **Fin Style** | Straight Fin | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Design and Engineering Features #### A. Thermal Performance The heat sink uses a **straight-fin** geometry. This design is optimized for environments with consistent airflow (forced convection). The fin density and spacing are calculated to maximize surface area while minimizing pressure drop. #### B. Mounting Mechanism (Push-Pin) * **Ease of Assembly:** The brass push-pins allow for quick installation onto the PCB without the need for complex tools. * **Constant Pressure:** The pins are integrated with springs that provide consistent downward pressure, ensuring a stable interface between the heat sink and the electronic component. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste and ensures a high-conductivity path from the chip to the aluminum body. --- ### 3. Common Applications This specific model is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and motherboards. 3. **Power Electronics:** Voltage regulators and high-power LED drivers. --- ### 4. Selection Criteria When integrating the ATS-03G-110-C2-R1, engineers must verify the **PCB Hole Pattern**. For this model, the hole-to-hole spacing must match the push-pin dimensions to ensure a secure fit and proper thermal contact.