Datenblatt-Suchmaschine für elektronische Bauteile
  German  ▼
ALLDATASHEETDE.COM

X  

  • ATS-04H-72-C2-R0

  • AI
    The **ATS-04H-72-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Key Technical Specifications Below is the detailed breakdown of the part's physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design Elements The part is engineered for specific airflow conditions and mounting stability: * **Fins:** The straight fin design is optimized for high-velocity airflow environments (forced convection). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This provides consistent pressure on the electronic chip, which improves heat transfer efficiency. * **Compression Springs:** The "R0" designation refers to the specific spring tension, ensuring the heat sink stays flush against the component during vibration or thermal expansion. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiative heat transfer and protecting the aluminum from corrosion. --- ### 3. Thermal Performance Data Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the component. For the ATS-04H-72-C2-R0: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | 5.11 | | 400 LFM | 2.36 | | 600 LFM | 1.55 | | 800 LFM | 1.25 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Part Number Decoder (ATS-04H-72-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Series / Product Family | | **H** | High Performance / Fin Density Profile | | **72** | Specific Model Size (45x45x25mm) | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Revision / Packaging Variant | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this heat sink?
    • ⤷ Is the T766 thermal interface material suitable for high-temperature applications?
    • ⤷ How does this straight fin design compare to cross-cut fin designs for airflow?