ATS-04H-72-C2-R0
AI

The **ATS-04H-72-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power ASICs.
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### 1. Key Technical Specifications
Below is the detailed breakdown of the part's physical and thermal characteristics:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Fin Pattern** | Straight Fin |
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### 2. Physical Design Elements
The part is engineered for specific airflow conditions and mounting stability:
* **Fins:** The straight fin design is optimized for high-velocity airflow environments (forced convection).
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This provides consistent pressure on the electronic chip, which improves heat transfer efficiency.
* **Compression Springs:** The "R0" designation refers to the specific spring tension, ensuring the heat sink stays flush against the component during vibration or thermal expansion.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface emissivity, slightly improving radiative heat transfer and protecting the aluminum from corrosion.
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### 3. Thermal Performance Data
Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the component. For the ATS-04H-72-C2-R0:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 LFM | 5.11 |
| 400 LFM | 2.36 |
| 600 LFM | 1.55 |
| 800 LFM | 1.25 |
*Note: Lower °C/W values indicate better cooling performance.*
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### 4. Part Number Decoder (ATS-04H-72-C2-R0)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04** | Series / Product Family |
| **H** | High Performance / Fin Density Profile |
| **72** | Specific Model Size (45x45x25mm) |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | Revision / Packaging Variant |
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- ⤷
What are the PCB hole requirements for mounting this heat sink?
- ⤷ Is the T766 thermal interface material suitable for high-temperature applications?
- ⤷ How does this straight fin design compare to cross-cut fin designs for airflow?