The **ATS-04H-91-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary electronic and mechanical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 21.92°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it increases emissivity and provides a protective layer against corrosion and electrical shorting should a wire touch the surface. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-04H-91-C2-R0** uses a mechanical push-pin system. * **Material:** Brass pins with stainless steel springs. * **Purpose:** Ensures consistent downward pressure on the electronic component (IC), which optimizes the contact between the chip and the heat sink for better thermal transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the electronic component's surface and the heat sink base. * **Performance:** It eliminates the need for manual application of thermal paste, reducing assembly time and errors in production. --- ### 3. Application Performance Thermal resistance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.92 | | 300 (1.5 m/s) | 10.21 | | 500 (2.5 m/s) | 7.62 | | 700 (3.5 m/s) | 6.54 | --- ### 4. Typical Use Cases * **Integrated Circuits (ICs):** Cooling BGA and FPGA chips. * **Power Supplies:** Managing heat in voltage regulators. * **Telecommunications:** Used in routers and switches where high-reliability cooling is required.