AI

The **ATS-06D-101-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series, designed to provide efficient cooling for electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
---
### 1. Key Technical Specifications
| Parameter | Specification | Details |
| :--- | :--- | :--- |
| **Part Number** | ATS-06D-101-C2-R0 | Manufacturer: Advanced Thermal Solutions Inc. |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance |
| **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism for secure mounting |
| **Thermal Resistance** | 6.69°C/W (at 100 LFM) | Rate at which heat is dissipated from the component |
| **Dimensions** | 45mm x 45mm x 30mm | Standard square footprint with a 30mm height |
---
### 2. Design and Components
The effectiveness of this part relies on several critical design features:
* **Fin Pattern (Straight Fin):** The vertical fins increase the total surface area exposed to the air. This specific model uses a straight-fin design, which is ideal for systems with clear, high-velocity airflow.
* **Compression Springs:** The "R0" designation refers to the specific spring force. These ensure even pressure across the surface of the electronic chip, maximizing the effectiveness of the thermal interface material (TIM).
* **Push-Pin Attachment:** Instead of messy adhesives or heavy screws, it uses plastic or brass pins that snap into pre-drilled holes on the PCB.
---
### 3. Application in Electronics
This component is essential in hardware design to prevent **thermal throttling** or permanent damage. It is typically found in:
1. **Telecommunications Gear:** High-speed routers and switches.
2. **Embedded Systems:** Industrial computers that run 24/7.
3. **Power Supplies:** Cooling voltage regulators that generate significant heat.
---
### 4. Code Representation (Thermal Simulation Mockup)
If you were modeling the thermal behavior of this part in a simulation script (Python), it might look like this:
```python
class HeatSink:
def __init__(self, model, resistance_lfm, dimensions):
self.model = model
self.thermal_resistance = resistance_lfm # °C/W
self.dims = dimensions # mm
# Instance for ATS-06D-101-C2-R0
ats_sink = HeatSink(
model="ATS-06D-101-C2-R0",
resistance_lfm=6.69,
dimensions=(45, 45, 30)
)
def calculate_temp_rise(power_watts):
return power_watts * ats_sink.thermal_resistance
print(f"Temp rise at 5W: {calculate_temp_rise(5)}°C")
```
- ⤷
What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I determine if the 45mm footprint will fit my PCB layout?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for this specific model?