The part number **ATS-06H-132-C2-R0** refers to a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components such as processors, FPGAs, and ASICs. ### Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Attachment Method** | superGRIP (Clip-on) | | **Dimensions (L x W x H)** | 70mm x 70mm x 25mm | | **Thermal Resistance** | 2.66°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Component Breakdown To understand this part's function in an electronic system, we can break it down into three main categories: #### 1. Heat Dissipation (The Fin Design) The "Straight Fin" geometry is optimized for **forced air cooling**. This means it performs best when paired with a system fan that pushes air across the fins. The aluminum construction provides a high rate of thermal conductivity while keeping the component lightweight. #### 2. Mechanical Attachment (superGRIP) The "06H" and "R0" designations often relate to the specific mounting hardware. The superGRIP technology includes: * **Plastic Frame Clip:** A frame that snaps onto the PCB without requiring holes. * **Metal Spring Clip:** A high-tension "U" shaped clip that provides consistent pressure between the heat sink and the chip, ensuring maximum heat transfer. #### 3. Thermal Interface (TIM) The **C2** code indicates that the heat sink comes with **T766** phase-change material pre-applied. This material fills the microscopic air gaps between the chip surface and the heat sink base, which is critical because air is a poor conductor of heat. ### Applications This specific size (70x70mm) is commonly used for: * **Network Switches:** Cooling high-speed packet processors. * **Industrial Computers:** Managing heat in fan-cooled enclosures. * **Power Supplies:** Cooling large MOSFET arrays or power modules. ---