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  • ATS-12D-159-C2-R0

  • AI
    The **ATS-12D-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.09°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body (The "Fin" Structure) The core component is made of **Aluminum 6063**. It uses a **Fine Pitch** design to maximize the surface area available for air-to-metal heat transfer. * **Dimensions:** 45mm x 45mm. * **Height:** 20mm (Low profile for tight enclosures). #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **Push-Pin** system. * **Material:** Brass with a stainless steel spring. * **Function:** It provides consistent pressure (Clamping Force) across the component's surface, ensuring optimal contact with the heat source. #### 3. Thermal Interface Material (TIM) The bottom of the unit comes pre-applied with **T766**. * **Function:** This is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. #### 4. Blue Anodized Finish This is not just for aesthetics. The anodization process increases the **emissivity** of the aluminum surface, which slightly improves heat dissipation through radiation and protects the metal from environmental corrosion. --- ### Performance Data Thermal resistance depends on the Airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 2.09 | | 300 | 1.25 | | 500 | 1.02 | | 700 | 0.89 |
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required for the push-pin installation?
    • ⤷ How does the T766 thermal material compare to standard thermal paste?
    • ⤷ Is this heat sink compatible with specific BGA or LGA socket sizes?