ATS-12D-159-C2-R0
AI

The **ATS-12D-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 2.09°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### Key Electronic & Physical Components
#### 1. Heat Sink Body (The "Fin" Structure)
The core component is made of **Aluminum 6063**. It uses a **Fine Pitch** design to maximize the surface area available for air-to-metal heat transfer.
* **Dimensions:** 45mm x 45mm.
* **Height:** 20mm (Low profile for tight enclosures).
#### 2. Push-Pin Attachment Mechanism
Instead of using messy adhesives or permanent solder, this part uses a **Push-Pin** system.
* **Material:** Brass with a stainless steel spring.
* **Function:** It provides consistent pressure (Clamping Force) across the component's surface, ensuring optimal contact with the heat source.
#### 3. Thermal Interface Material (TIM)
The bottom of the unit comes pre-applied with **T766**.
* **Function:** This is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance.
#### 4. Blue Anodized Finish
This is not just for aesthetics. The anodization process increases the **emissivity** of the aluminum surface, which slightly improves heat dissipation through radiation and protects the metal from environmental corrosion.
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### Performance Data
Thermal resistance depends on the Airflow (LFM - Linear Feet per Minute):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 2.09 |
| 300 | 1.25 |
| 500 | 1.02 |
| 700 | 0.89 |
- ⤷
What are the specific hole patterns required for the push-pin installation?
- ⤷ How does the T766 thermal material compare to standard thermal paste?
- ⤷ Is this heat sink compatible with specific BGA or LGA socket sizes?