The **ATS-18A-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Flowing Air)** | 6.67°C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 12.00°C/W | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Connectivity & Design Features While a heat sink is a passive component, its design is engineered for specific electronic environments: * **pushPIN™ Attachment:** This model uses a tool-free mounting system. It features a brass pin and a stainless steel spring that ensures even pressure across the electronic chip (TIM - Thermal Interface Material), improving heat transfer efficiency. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or a high-performance thermal pad, which fills the microscopic air gaps between the component and the heat sink. * **C2 Rating:** The "C2" in the part number indicates a specific color/material coding, typically associated with the **Blue Anodized** finish, which provides added corrosion resistance and minor electrical insulation for the surface of the aluminum. --- ### 3. Typical Applications This specific part is widely used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Industrial PC (IPC):** Providing thermal stability for processors in harsh environments. 3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs) or MOSFET arrays. 4. **Embedded Systems:** Used on single-board computers that require active or passive cooling within a chassis. --- ### 4. Thermal Performance Curve As airflow increases, the thermal resistance drops significantly, allowing the electronic part to operate at higher clock speeds or power outputs: * **@ 200 LFM:** 4.15°C/W * **@ 400 LFM:** 2.65°C/W * **@ 600 LFM:** 2.05°C/W