The **ATS-18B-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18B-101-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 1.01°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Design and Component Breakdown #### A. The Fin Profile (Cross-Cut) The unit features a **straight fin** design with cross-cuts. This geometry is optimized for "high-flow" environments. The cross-cuts allow air to flow through the fins from multiple angles, reducing the pressure drop across the heat sink and improving cooling efficiency in dense PCB layouts. #### B. pushPIN™ Attachment System Instead of simple adhesive or clips, this part uses the **pushPIN™** system: * **Springs:** Pre-installed springs ensure consistent downward pressure (3.0 lbs average) on the component, which is critical for maintaining contact with the Thermal Interface Material (TIM). * **Plastic/Brass Pins:** These secure the heat sink to the PCB through pre-drilled holes, preventing the component from shifting during vibration or shipping. #### C. Thermal Interface Material (T766) The "C2" in the part number indicates a specific thermal compound (T766) pre-applied to the base. This material fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. --- ### 3. Thermal Performance Analysis The efficiency of this part is measured by its **Thermal Resistance**. A lower value indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 2.10 | | 200 LFM (1.0 m/s) | 1.01 | | 400 LFM (2.0 m/s) | 0.73 | --- ### 4. Typical Applications * **Telecom & Networking:** Used on ASICs and FPGAs in switches and routers. * **Industrial PC (IPC):** Cooling embedded processors in rugged environments. * **Power Supplies:** Managing heat for MOSFETs and power regulators.