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  • ATS-18G-51-C1-R0

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    The **ATS-18G-51-C1-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins with springs) | | **Thermal Resistance** | 1.83°C/W (at 200 LFM) | | **Length x Width** | 40mm x 40mm | | **Height** | 20mm | | **Direction** | Omni-directional (Pin Fin) | --- ### 2. Physical Design Components * **Pin Fin Array:** Unlike straight-fin heat sinks, the pin-fin design allows for air to flow from any direction (omni-directional). This makes it ideal for crowded PCB environments where airflow direction might be turbulent or inconsistent. * **pushPIN™ Mounting:** This model utilizes a spring-loaded brass pin mechanism. This ensures consistent pressure (clamping force) between the heat sink and the component, improving thermal transfer while preventing damage to the PCB. * **Pre-Applied Thermal Interface Material (TIM):** This part typically comes with a high-performance thermal pad or grease (often ATS-61 or similar) pre-applied to the base to ensure a low-resistance path between the chip and the aluminum. --- ### 3. Application Use Cases This specific heat sink is commonly found in the following electronic systems: * **Networking Equipment:** Routers and switches where airflow might be multidirectional. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. * **Power Supplies:** Cooling voltage regulators or power modules. ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how efficiently the part moves heat away from the silicon. ```markdown Airflow (LFM) | Thermal Resistance (°C/W) ----------------------------------------- 200 LFM | 1.83 400 LFM | 1.25 600 LFM | 1.05 ``` ---
    ✨ Follow-up Questions
    • What are the advantages of blue anodizing over plain aluminum for this part?
    • How does the pushPIN mounting system compare to adhesive thermal tapes?
    • What is the recommended hole pattern on the PCB for installing the ATS-18G-51-C1-R0?