The **ATS-18G-51-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.62 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Attachment Method** | pushPIN™ (Brass Springs) | | **Interface Material** | T766 (Thermal Interface Material) | --- ### 2. Design Characteristics This heat sink utilizes a **Fine Pitch** design, which provides a high surface-area-to-volume ratio, making it ideal for high-density electronic assemblies. * **Fins:** The straight fin design allows for optimized airflow through the component, reducing the temperature of the underlying chip. * **Attachment:** The `pushPIN™` system ensures a secure fit with a precise amount of pressure. This avoids damage to the PCB while ensuring maximum contact with the heat source. * **Springs:** Utilizes stainless steel or brass springs to maintain consistent downward force. --- ### 3. Part Number Decoding The part number can be broken down to understand its specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **18G** | Series/Kit Identification | | **51** | Specific Fin/Pattern Configuration | | **C2** | Thermal Performance Level / Grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Common Applications This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** CPU/GPU cooling in embedded systems. * **Power Electronics:** Cooling for MOSFETs and power regulators. * **Industrial Controls:** Heat dissipation for logic controllers.