The **ATS-60003-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, which is designed to provide low thermal resistance and high airflow efficiency. --- ### 1. Technical Specifications Below are the primary technical characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | maxiFLOW™ | | **Attachment Method** | maxiGRIP™ (Standard Clip-on) | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 0.90 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 41.00mm x 45.00mm x 24.50mm | | **Fin Style** | Spread Fin / Flared | --- ### 2. Key Electronic Features #### A. Flared Fin Design Unlike standard straight-fin heat sinks, the **maxiFLOW™** geometry features fins that flare outward. This design: * Reduces pressure drop across the component. * Increases the surface area available for convection. * Maximizes the cooling capacity in constrained airflow environments. #### B. maxiGRIP™ Attachment The "C1-R0" designation refers to the attachment system. This is a mechanical clip system that: * Provides high pressure for optimal **Thermal Interface Material (TIM)** performance. * Eliminates the need to drill holes in the PCB. * Allows the heat sink to be securely mounted to the electronic component (usually a BGA package) without damaging the board traces. #### C. Thermal Performance The heat sink is engineered for high-heat-density components. At varying airflow speeds (LFM - Linear Feet per Minute), its performance scales as follows: * **1.30 °C/W** @ 100 LFM (Low Airflow) * **0.90 °C/W** @ 200 LFM (Standard Airflow) * **0.60 °C/W** @ 400 LFM (High-performance Cooling) --- ### 3. Common Applications This part is typically found in high-reliability electronic systems: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded processors, FPGAs, and ASICs. * **Power Electronics:** Cooling for high-density power modules. --- ### 4. Component Material Composition ```json { "Material": "Aluminum 6063", "Finish": "Black Anodized", "RoHS": "Compliant", "Attachment_Spring": "Plastic/Stainless Steel" } ```