The **ATS-P1-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for board-level component cooling, typically used for CPUs, GPUs, or other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing Air)** | 1.15 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 6.69 °C/W | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Electronic Application Details #### Thermal Management The primary electronic function of this part is to dissipate heat generated by semiconductors. At a thermal resistance of **1.15 °C/W** (under airflow), it is highly efficient at preventing thermal throttling in high-speed processors. #### Attachment Mechanism (Push-Pin) The "P1" in the part number signifies the push-pin attachment system. This is critical for electronics because: * **Constant Pressure:** It provides a consistent downward force on the chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Vibration Resistance:** The spring-loaded pins prevent the heat sink from shifting during transport or operation. #### Material Properties The use of **AL6063 Aluminum** provides a balance between high thermal conductivity and low weight. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased surface emissivity (better radiation cooling). * Corrosion resistance. * Electrical insulation to prevent short circuits if the sink accidentally contacts stray wires. --- ### 3. Airflow Performance Data | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.69 (Unducted) | | 400 | 2.0 | 1.15 | | 600 | 3.0 | 0.90 | ---