The **ATS-P2-133-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink from the "maxiFLOW™" series designed for cooling high-heat-generating integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 7.22°C/W @ 100 LFM; 2.25°C/W @ 600 LFM | | **Attachment Method** | pushPIN™ (Brass pins + Stainless Steel springs) | | **Thermal Interface Material (TIM)** | T766 (High performance pre-applied grease) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Electronic Functions & Design This part is critical for the stability of sensitive electronic systems. Its design focuses on three main electronic-thermal principles: * **Heat Dissipation:** It is designed to sit atop high-power components (like CPUs, FPGAs, or GPUs) to draw heat away from the silicon die. * **maxiFLOW™ Geometry:** The fins are tapered and angled. This increases the surface area for convective cooling while maintaining a low pressure drop, allowing air to flow more freely through the electronic enclosure. * **Thermal Interface Material (T766):** The base includes a pre-applied thermal grease. This "electronics-grade" TIM ensures there are no microscopic air gaps between the chip and the metal, maximizing heat transfer efficiency. --- ### 3. Application in Electronics The **ATS-P2-133-C2-R0** is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in base stations. 2. **Embedded Systems:** High-density PCBs where vertical space is limited (10mm height). 3. **Industrial Controls:** Protecting power regulators from thermal throttling or failure. --- ### 4. Mounting Mechanism (pushPIN™) The "P2" in the part number refers to the specific mounting hardware. Instead of adhesive tape, it uses: * **Compression Springs:** These provide a calculated, consistent pressure (load) on the electronic chip to prevent cracking the die while ensuring optimal thermal contact. * **Hardware:** It requires pre-drilled holes in the PCB for the plastic or brass pins to lock into.