The **ATS-P2-193-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-193-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 6.00mm | | **Thermal Resistance** | 21.11°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (straight fins) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the physical and thermal properties: * **ATS**: Manufacturer prefix. * **P2**: Represents the specific series/attachment style. * **193**: The specific model identifier for size and fin geometry. * **C2**: Indicates the material/finish (Blue Anodized Aluminum). * **R0**: Refers to the revision or packaging standard. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) This part usually comes with a pre-applied **T766** thermal interface material. This is crucial for filling microscopic air gaps between the electronic component (heat source) and the heat sink base, ensuring maximum heat transfer. #### B. PushPIN™ Mounting System Unlike adhesive-based heat sinks, the pushPIN system uses a flexible, spring-loaded mechanism. This is vital for electronic reliability because: * It provides **uniform pressure** across the chip. * It prevents damage from mechanical shock or vibration. * It allows for easy removal and re-application during PCB maintenance. #### C. Fin Design The heat sink uses a **Fine Pitch** straight-fin design. In electronics, this is optimized for "forced air" environments (where a fan is present). The narrow spacing between fins maximizes surface area, allowing air to carry away heat more efficiently than a flat plate. --- ### 4. Application Use-Cases This specific heat sink is "low-profile" (only 6mm high), making it ideal for: * **1U Server Chassis:** Where vertical space is extremely limited. * **Networking Switches:** Cooling high-speed ASICs or FPGAs. * **Embedded Computing:** Industrial motherboards where height constraints exist.