The **ATS-P2-37-C2-R0** is a high-performance thermal management component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "superGRIP" series. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height (Height Off Base)** | 20mm | | **Thermal Resistance** | 26.22°C/W (Unducted Flow @ 100 LFM) | | **Fin Configuration** | Fine Pitch (Straight Fin) | --- ### 2. Physical Design & Construction The part is engineered to dissipate heat from electronic surface-mount components (like BGA chips). * **Fin Pattern:** It uses a high-density fin array to maximize surface area for heat exchange with the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material that ensures a low-resistance thermal path between the chip and the sink. * **Push-Pin Mechanism:** The "P2" in the part number indicates a specific push-pin design. These are spring-loaded pins that provide consistent pressure across the interface, improving thermal contact. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 26.22 | | 200 (1.0 m/s) | 14.18 | | 300 (1.5 m/s) | 9.63 | | 400 (2.0 m/s) | 7.37 | --- ### 4. Applications This heat sink is commonly found in: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Industrial PCs:** Compact motherboards where vertical space is limited to 20mm. * **Power Supplies:** To cool MOSFETs or voltage regulators. * **Embedded Systems:** Cooling CPUs or FPGAs in enclosed chassis.