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  • ATS-P2-47-C2-R0

  • AI
    The **ATS-P2-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" product line designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the ATS-P2-47-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.58 °C/W (@ 1.0 m/s airflow) | | **Pressure Drop** | 0.28 inH2O (@ 1.0 m/s) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Design The heat sink features a tapered fin design. In electronics, this maximizes the surface area for heat dissipation while minimizing the pressure drop, allowing air to flow more efficiently through the fins. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **-R0** variant uses a pushPIN™ system. * **Mechanical Stability:** It provides a precise, consistent pressure on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Reliability:** It is more resistant to vibration and thermal expansion/contraction cycles compared to thermal tape. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific part is typically used in the following electronic environments: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Compact systems requiring passive or active airflow cooling. * **Power Electronics:** Cooling MOSFETs or power regulators in high-density layouts. ---
    ✨ Follow-up Questions
    • ⤷ What are the different pushPIN material options available for this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal pads?
    • ⤷ Can this heat sink be used in a fanless (natural convection) environment?