ATS-P2-47-C2-R0
AI

The **ATS-P2-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" product line designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the ATS-P2-47-C2-R0:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.58 °C/W (@ 1.0 m/s airflow) |
| **Pressure Drop** | 0.28 inH2O (@ 1.0 m/s) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Electronic Features
#### A. maxiFLOW™ Design
The heat sink features a tapered fin design. In electronics, this maximizes the surface area for heat dissipation while minimizing the pressure drop, allowing air to flow more efficiently through the fins.
#### B. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the **-R0** variant uses a pushPIN™ system.
* **Mechanical Stability:** It provides a precise, consistent pressure on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM).
* **Reliability:** It is more resistant to vibration and thermal expansion/contraction cycles compared to thermal tape.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance.
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### 3. Application Use Cases
This specific part is typically used in the following electronic environments:
* **Networking Equipment:** High-speed routers and switches.
* **Industrial PCs:** Compact systems requiring passive or active airflow cooling.
* **Power Electronics:** Cooling MOSFETs or power regulators in high-density layouts.
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- ⤷
What are the different pushPIN material options available for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal pads?
- ⤷ Can this heat sink be used in a fanless (natural convection) environment?