The **ATS-P2-86-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These are used to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimension (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 12.48°C/W (at 100 LFM) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### 2. Core Electronic Components The "part" itself is a passive mechanical cooling assembly. It consists of three primary sub-components: #### A. The Heatsink Body * **Material:** Constructed from high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. * **Surface Treatment:** The "Blue Anodized" finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiative cooling. #### B. The Push-Pin Mechanism * **Function:** This provides the mechanical force required to hold the heatsink against the chip. * **Flexibility:** It is designed with pre-drilled holes in the PCB to ensure consistent pressure, which is critical for the efficiency of the Thermal Interface Material (TIM). #### C. The Thermal Interface Material (TIM) * **Pre-applied:** This specific model usually comes with a pre-applied high-performance thermal pad or grease (often ATS-specific "Chomerics" or similar). * **Role:** It fills microscopic air gaps between the flat surface of the electronic component and the bottom of the heatsink to ensure maximum heat transfer. --- ### 3. Thermal Performance Metrics The effectiveness of the ATS-P2-86-C2-R0 is measured by its **Thermal Resistance** (expressed in °C/W). Lower values represent better cooling. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.48 | | 300 | 1.5 | 5.92 | | 500 | 2.5 | 4.41 | | 700 | 3.5 | 3.70 | --- ### 4. Application Use-Case This part is typically found in: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial computers where space is restricted (15mm height). 3. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules).