The **CTMPC080605F-R47M** is a high-performance, surface-mount (SMD) power inductor. It is part of the "Molded" power inductor category, which is specifically designed for high-density power applications where space is limited and efficiency is critical. --- ### 1. Technical Specifications Below are the primary electrical and physical characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.47 µH | | **Tolerance** | ±20% (M) | | **Case Size (Metric)** | 2016 (2.0mm x 1.6mm) | | **Height (Max)** | 0.5 mm | | **DC Resistance (DCR)** | Typ: 35 mΩ / Max: 41 mΩ | | **Isat (Saturation Current)** | ~4.1 A (based on 30% drop) | | **Irms (Rated Current)** | ~3.3 A (based on 40°C rise) | | **Operating Temp** | -40°C to +125°C | --- ### 2. Part Number Breakdown The nomenclature provides specific details about the part's construction: * **CTMPC**: Series name (Commonly refers to Metal Polymer/Molded Power Chip). * **0806**: Dimensions in inches (approx. 0.08" x 0.06") corresponding to the 2016 metric size. * **05**: Max height profile (0.5 mm). * **F**: Lead-free / RoHS compliant. * **R47**: Inductance value (R = decimal point), so 0.47 µH. * **M**: Tolerance (M = ±20%). --- ### 3. Key Features & Construction * **Molded Structure**: The coil is embedded in a metallic magnetic powder. This construction provides excellent magnetic shielding, reducing Electromagnetic Interference (EMI). * **High Current Density**: Because of the metal powder core, these inductors handle higher saturation currents compared to traditional ferrite cores of the same size. * **Low Profile**: At only 0.5mm height, it is ideal for ultra-thin electronics like smartphones, wearables, and tablets. * **Soft Saturation**: Unlike ferrite cores that have a sharp drop in inductance at peak currents, this part exhibits "soft saturation," meaning it maintains better performance under heavy load. --- ### 4. Typical Applications This component is generally used in high-frequency DC-DC converters: 1. **Smartphones & Tablets**: Power management IC (PMIC) circuits. 2. **Wearables**: Smartwatches and fitness trackers requiring small footprints. 3. **SSD/HDD**: Power rails for solid-state drives. 4. **IoT Devices**: Low-power wireless modules where efficiency is key.