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  • LP5064R-R45M

  • AI
    The **LP5064R-R45M** is a high-current, low-profile power inductor typically used in DC-DC converter applications, such as Point-of-Load (POL) converters and high-density power modules. --- ### 1. Key Technical Specifications Based on standard industry naming conventions for this series (often associated with manufacturers like Cyntec or similar power component specialists), the specifications are generally as follows: | Parameter | Typical Value | Description | | :--- | :--- | :--- | | **Inductance** | 0.45 µH | The nominal inductance at 0A. | | **Tolerance** | ±20% | Standard deviation for the inductance value (M code). | | **DCR (Direct Current Resistance)** | ~0.8 - 1.2 mΩ | The internal resistance; lower is better for efficiency. | | **Isat (Saturation Current)** | 40A - 60A | The current at which inductance drops by a specific % (usually 30%). | | **Irms (Rated Current)** | 30A - 45A | The continuous current that causes a specific temperature rise (usually 40°C). | | **Dimensions** | 5.0 x 5.0 x 6.4 mm | Physical footprint (may vary slightly by specific manufacturer series). | --- ### 2. Breakdown of the Part Number * **LP**: Indicates the series (Low Profile / Power Inductor). * **5064**: Refers to the physical size (e.g., 5.0mm x 5.0mm footprint, 6.4mm height). * **R**: Often denotes a specific core material or RoHS compliance. * **R45**: Represents the inductance value. `R` acts as a decimal point, so `R45` = 0.45 µH. * **M**: Represents the tolerance, where `M` stands for ±20%. --- ### 3. Core Features and Applications #### Features: * **High Efficiency:** Low DCR minimizes power loss through heat. * **Molded Construction:** Usually features a metal powder core which provides excellent saturation characteristics and shielding against EMI (Electromagnetic Interference). * **Thermal Stability:** Designed to operate in high-temperature environments (often up to 125°C or 150°C). #### Common Applications: 1. **Voltage Regulator Modules (VRMs):** Found near CPUs and GPUs in servers and workstations. 2. **DC/DC Converters:** Used in buck, boost, or buck-boost topologies. 3. **Battery Powered Devices:** High current capability in a small footprint for mobile hardware. --- ### 4. Implementation Example When designing a PCB with the LP5064R-R45M, it is crucial to ensure the copper traces are wide enough to handle the high rated current. ```markdown # Layout Recommendations 1. Place the inductor as close to the switching IC as possible. 2. Use multiple vias to connect the inductor pads to internal power planes. 3. Minimize the "switch node" area to reduce EMI radiation. ```
    ✨ Follow-up Questions
    • What is the maximum operating temperature for the LP5064 series?
    • How does the saturation current (Isat) compare to the heat rating current (Irms) in this model?
    • Are there smaller footprint alternatives with the same 0.45µH inductance?