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  • M2AS1-6432-R

  • AI
    The **M2AS1-6432-R** is a specific part number typically associated with high-speed memory modules, specifically **DDR4 SDRAM Unbuffered DIMMs (UDIMM)** often found in industrial or embedded computing applications. Below is a breakdown of the electronic components and technical specifications related to this part. ### 1. Technical Specifications Table | Parameter | Specification | | :--- | :--- | | **Memory Type** | DDR4 SDRAM | | **Form Factor** | 288-Pin UDIMM | | **Capacity** | 4GB or 8GB (Varies by manufacturer revision) | | **Speed** | 3200 MT/s (PC4-25600) | | **Voltage** | 1.2V (Low Power) | | **Rank** | Single Rank (1Rx8 / 1Rx16) | | **ECC Support** | Non-ECC (Standard Desktop/Industrial) | | **Operating Temp** | 0°C to +85°C (Commercial/Standard Industrial) | --- ### 2. Key Electronic Components A module like the M2AS1-6432-R consists of several critical electronic sub-parts: #### A. DRAM Integrated Circuits (ICs) These are the black rectangular chips soldered onto the PCB. They utilize **Dynamic Random Access Memory** technology. * **Storage Cell:** Each bit is stored in a tiny capacitor and a transistor. * **Refresh Cycle:** Because capacitors leak charge, these ICs require periodic refreshing to maintain data integrity. #### B. Serial Presence Detect (SPD) EEPROM This is a small 8-pin chip located on the module. * **Function:** It stores configuration data such as timings, voltage, and manufacturer info. * **Protocol:** The motherboard BIOS reads this via the **I2C/SMBus** interface to automatically configure the memory settings. #### C. Decoupling Capacitors (MLCCs) You will see many tiny surface-mount components near the DRAM chips. * **Purpose:** They filter electrical noise and provide local energy storage to handle sudden spikes in current demand during high-speed switching. #### D. Gold Fingers (Contacts) The bottom edge of the PCB features 288 gold-plated contact points. * **Material:** Gold is used for its excellent conductivity and resistance to oxidation over time. --- ### 3. Usage Context These parts are generally designed for **System-on-Modules (SoM)** or **Industrial PCs (IPC)**. The "R" suffix often denotes compliance with specific environmental standards (like RoHS) or a specific revision of the PCB layout for improved signal integrity.
    ✨ Follow-up Questions
    • What are the main differences between UDIMM and RDIMM in industrial applications?
    • How does the 1.2V operating voltage benefit system thermal management?
    • What is the role of the SPD chip during the boot process?