The **M2AS1-A113-R2** is a specific technical part number, typically associated with specialized electronic cooling systems or heat sink assemblies (often used in server or industrial computing environments). Below is a breakdown of its electronic and mechanical characteristics. --- ### 1. General Specifications The part is primarily an **Active Heat Sink** assembly designed for localized cooling of microprocessors or high-power ICs. | Feature | Description | | :--- | :--- | | **Component Type** | Active Thermal Solution (Fan + Heat Sink) | | **Primary Material** | Aluminum fins with a Copper base (usually) | | **Interface** | 4-Pin PWM Connector | | **Mounting Style** | Screw-mount (Spring-loaded) | | **Application** | Low-profile servers, 1U/2U Chassis | --- ### 2. Electronic Components While the body is mechanical, the "active" part of the assembly contains several critical electronic elements: #### A. DC Brushless Fan Motor * **Operating Voltage:** Typically 12V DC. * **Control Method:** Pulse Width Modulation (PWM). This allows the system BIOS or controller to adjust fan speed based on real-time temperature sensors. * **Feedback:** Includes a **Tachometer (Hall Effect Sensor)** output to communicate the current RPM to the motherboard. #### B. The 4-Pin Connector Pinout The electronics interface via a standard 4-pin header: 1. **Ground (GND):** Power return. 2. **+12V:** Constant power supply. 3. **Sense (Tach):** Outputs 2 pulses per revolution to measure speed. 4. **Control (PWM):** Input signal to regulate motor duty cycle. #### C. Thermal Interface Material (TIM) * The bottom of the unit usually features a pre-applied phase-change material or high-conductivity thermal grease. * **Function:** Fills microscopic air gaps between the semiconductor die and the heat sink base to lower thermal resistance ($R_{th}$). --- ### 3. Mechanical & Structural Design * **Heat Dissipation Path:** Conductive heat transfer from the chip $\rightarrow$ Copper base $\rightarrow$ Aluminum fins $\rightarrow$ Convective heat transfer to the air via the fan. * **Form Factor:** Designed for specific socket architectures (often proprietary or standard Intel/AMD server sockets depending on the exact revision). ---