M3H55FBD-R
AI

The **M3H55FBD-R** is a specific part number typically associated with **DRAM Memory Modules**, specifically fully buffered DIMMs (FB-DIMMs) produced by manufacturers like Micron or Samsung. This specific part is often found in legacy server environments (such as Dell PowerEdge or HP ProLiant servers) utilizing the Intel Xeon 5000/5400 series chipsets.
Below is an explanation of the electronic components and technical specifications.
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### 1. Technical Specifications
The part number follows a specific nomenclature used in the memory industry. Here is the breakdown of its primary electronic characteristics:
| Characteristic | Specification |
| :--- | :--- |
| **Memory Type** | DDR2 SDRAM |
| **Form Factor** | FB-DIMM (Fully Buffered Dual Inline Memory Module) |
| **Capacity** | 4GB (Typical for this series) |
| **Speed** | PC2-5300F (667 MHz) |
| **Error Correction** | ECC (Error Correction Code) |
| **Rank** | 2Rx4 (Dual Rank) |
| **Voltage** | 1.8V |
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### 2. Key Electronic Components
An FB-DIMM module like the M3H55FBD-R is more complex than standard desktop RAM because it includes active logic chips:
#### A. Advanced Memory Buffer (AMB)
This is the most critical electronic part on the module. Unlike standard RAM where the memory controller communicates directly with the DRAM chips, FB-DIMMs use the **AMB**.
* **Function:** It converts the high-speed serial interface from the memory controller into the parallel signals required by the DDR2 chips.
* **Thermal Note:** AMB chips generate significant heat, which is why these modules almost always have large metal heat spreaders.
#### B. DRAM Chips
These are the physical storage units.
* **Architecture:** Usually organized in a **x4** or **x8** width.
* **Density:** Higher density chips are used to reach the 4GB capacity on a single stick.
#### C. EEPROM (SPD - Serial Presence Detect)
A small 8-pin chip that stores data about the module's timings, voltage, and manufacturer. The BIOS reads this chip during POST to configure the memory controller correctly.
#### D. Passives (Capacitors and Resistors)
The PCB is populated with Surface Mount Device (SMD) capacitors to filter power noise and resistors to terminate signals, ensuring signal integrity across the high-speed serial bus.
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### 3. Use Case and Compatibility
Because of the **FB-DIMM** architecture, this part is physically and electrically incompatible with standard DDR2 desktop slots.
* **Connector:** It features a unique notch position to prevent insertion into non-buffered slots.
* **Primary Use:** High-reliability servers and workstations (e.g., Mac Pro 2006-2008, Dell Precision T7400).
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- ⤷
What is the difference between an FB-DIMM and a Registered DIMM (RDIMM)?
- ⤷ Why do FB-DIMM modules require large metal heat sinks?
- ⤷ Can I use M3H55FBD-R in a standard DDR2 desktop motherboard?