The **W.FL-R-1** is an ultra-small surface-mount (SMT) coaxial connector receptacle designed and manufactured by **Hirose Electric**. It is part of the W.FL series, known for being one of the smallest coaxial connector systems in the world, primarily used for high-frequency signal transmission in space-constrained electronics. --- ### 1. Key Technical Specifications The W.FL-R-1 is the "male" receptacle that is soldered onto the Printed Circuit Board (PCB). | Feature | Specification | | :--- | :--- | | **Mated Height** | 1.40 mm to 1.55 mm (depending on the plug) | | **Frequency Range** | DC to 6 GHz | | **Characteristic Impedance** | 50 Ohms | | **V.S.W.R.** | 1.3 Max (DC to 3 GHz), 1.4 Max (3 to 6 GHz) | | **Contact Resistance** | 20 mΩ Max (Center), 10 mΩ Max (Outer) | | **Operating Temperature** | -40°C to +90°C | | **Mounting Style** | Surface Mount (SMT) | --- ### 2. Physical Construction The part is engineered for precision and durability despite its microscopic size (occupying only **3.4 mm²** of board space). * **Center Contact:** Typically made of Phosphor Bronze with Gold plating to ensure high conductivity and corrosion resistance. * **Insulator:** Liquid Crystal Polymer (LCP), which can withstand the high heat of lead-free reflow soldering. * **Outer Shell:** Phosphor Bronze with Silver or Gold plating for effective grounding and EMI shielding. --- ### 3. Application Areas Due to its high-frequency performance and low profile, the W.FL-R-1 is found in: 1. **Mobile Devices:** Smartphones, tablets, and smartwatches for internal antenna connections. 2. **Wireless Modules:** Wi-Fi, Bluetooth, and GPS modules (M.2 cards). 3. **IoT Devices:** Small-scale sensors requiring wireless connectivity. 4. **Drones:** For lightweight RF signal routing between the receiver and flight controller. --- ### 4. Comparison: W.FL vs. U.FL It is often confused with the more common **U.FL** connector. Below are the primary differences: | Feature | U.FL (Common) | W.FL (This Part) | | :--- | :--- | :--- | | **Footprint Area** | 7.7 mm² | 3.4 mm² | | **Mated Height** | 1.9 mm - 2.5 mm | 1.4 mm | | **Weight** | ~15.7 mg | ~5.6 mg | | **Use Case** | Standard compact devices | Ultra-compact/Wearables | --- ### 5. Footprint Example (Simplified) When designing a PCB for this part, the landing pattern usually consists of a center signal pad and two larger flanking ground pads. ```markdown [ Ground Pad ] | | | [Signal Pad]| <-- W.FL-R-1 Receptacle Center | | [ Ground Pad ] ``` ---