# SN74LS151 & Related Series Datasheet Summary

## Product Overview
This document summarizes datasheet information for the SN74LS151 and related series of integrated circuits, including various package options and specifications. These are primarily dual-input multiplexer/demultiplexer devices.

## Key Features & Specifications
️· Device Function: Dual-Input Multiplexer/Demultiplexer
️· Logic Family: TTL (including SN74LS, SN74S, SN54/54LS/S)
️· Package Options:
- CDIP (Ceramic Dual In-Line Package) - J suffix
- PDIP (Plastic Dual In-Line Package) - N suffix
- SOIC (Small Outline Integrated Circuit) - D suffix
- SO (Small Outline) - NS suffix
- LCCC (Leadless Ceramic Chip Carrier) - FK suffix
- CQCC (Ceramic Quad Flatpack) - N suffix
- CFP (Ceramic Flatpack) - W suffix
️· Eco-Plan: Available in Pb-Free (RoHS) and Green (RoHS & no Sb/Br) options.
️· Moisture Sensitivity Level (MSL): Level 1 - 260C UNLIMITED for SOIC packages
️· Operating Temperature: Varies based on the specific device (e.g. SNJ54 series for military applications)

## Ordering Information & Status
️· Status Definitions: Active, LifeBuy, NRND (Not Recommended for New Designs), OBSOLETE, Preview.
️· Numerous part numbers are listed with package types, quantities, and status.

## Mechanical Data
️· Detailed mechanical drawings with dimensions are provided for several package types including:
- CDIP (J)
- PDIP (N)
- SOIC (D)
- LCCC (FK)
- CQCC (N)
- CFP (W)

## Important Notes
️· TI reserves the right to change product specifications without notice.
️· Customers are responsible for their product designs and applications using TI components.
️· Information on third-party products does not constitute a license or endorsement by TI.