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# Example questions:
➢ What hazardous material is present in the ceramic portion of the device and what precaution should be taken when handling it?
➢ What is the vth range for a device with code 'k'?
➢ What is the thermal resistance between the junction and case mounting surface of the device?
Okay, here's a summary of the provided text, broken down into categories to make it more digestible. This is a very technical document, so the summary aims to capture the essential details.
1. Device Identification & Purpose
️· Device: Microsemi RF Power Transistor (Likely a Gallium Nitride - GaN - device, based on the performance numbers and advanced features)
️· Part Number: Includes an optional suffix "MP" which signifies a matched pair with controlled Vth (threshold voltage) values.
️· Purpose: Designed for high-power RF applications (Likely amplifiers, transmitters, or similar).
2. Electrical Characteristics (Key Performance Numbers)
️· Vth (Threshold Voltage): GaN transistors' threshold voltage is tightly controlled and marked. See the table for specific ranges associated with each letter code (A-Z). The table defines the range of values for each device which is important for consistent device performance.
️· High Power: The device is capable of sustaining a significant amount of power
️· Matched Pair: the MP suffix on the part number indicates a tightly matched set for consistent performance
3. Thermal Considerations & Package
️· High Power Dissipation: Rated for a high power dissipation (1350W) under specific conditions (mounting surface at 25°C, junction temperature at 400°C)
️· Thermal Resistance: Low thermal resistance between the junction and the mounting surface, but requires proper heat sinking.
️· Beryllium Oxide Hazard: *Crucially*, the package contains beryllium oxide, a highly toxic substance when inhaled as dust. Strict precautions are required during handling and disposal. Never dispose of as general waste.
️· Mounting: Requires a flanged package. Must use thermal joint compound and incorporate a copper heat spreader.
4. Pinout and Dimensions
️· Pin 1: Drain
️· Pin 2: Source
️· Pin 3: Source
️· Pin 4: Gate
️· Provides the dimensions to verify correct device placement
5. Patents & Legal Information
️· The device is covered by a large number of U.S. and foreign patents. Microsemi retains all rights.
6. Hazardous Material Warning
️· The device package includes beryllium oxide, a highly toxic material. This requires special precautions during handling and disposal.
In essence, this document describes a high-performance RF power transistor with a key warning about beryllium oxide hazards. The matched MP suffix indicates carefully controlled performance parameters.
1. Device Identification & Purpose
️· Device: Microsemi RF Power Transistor (Likely a Gallium Nitride - GaN - device, based on the performance numbers and advanced features)
️· Part Number: Includes an optional suffix "MP" which signifies a matched pair with controlled Vth (threshold voltage) values.
️· Purpose: Designed for high-power RF applications (Likely amplifiers, transmitters, or similar).
2. Electrical Characteristics (Key Performance Numbers)
️· Vth (Threshold Voltage): GaN transistors' threshold voltage is tightly controlled and marked. See the table for specific ranges associated with each letter code (A-Z). The table defines the range of values for each device which is important for consistent device performance.
️· High Power: The device is capable of sustaining a significant amount of power
️· Matched Pair: the MP suffix on the part number indicates a tightly matched set for consistent performance
3. Thermal Considerations & Package
️· High Power Dissipation: Rated for a high power dissipation (1350W) under specific conditions (mounting surface at 25°C, junction temperature at 400°C)
️· Thermal Resistance: Low thermal resistance between the junction and the mounting surface, but requires proper heat sinking.
️· Beryllium Oxide Hazard: *Crucially*, the package contains beryllium oxide, a highly toxic substance when inhaled as dust. Strict precautions are required during handling and disposal. Never dispose of as general waste.
️· Mounting: Requires a flanged package. Must use thermal joint compound and incorporate a copper heat spreader.
4. Pinout and Dimensions
️· Pin 1: Drain
️· Pin 2: Source
️· Pin 3: Source
️· Pin 4: Gate
️· Provides the dimensions to verify correct device placement
5. Patents & Legal Information
️· The device is covered by a large number of U.S. and foreign patents. Microsemi retains all rights.
6. Hazardous Material Warning
️· The device package includes beryllium oxide, a highly toxic material. This requires special precautions during handling and disposal.
In essence, this document describes a high-performance RF power transistor with a key warning about beryllium oxide hazards. The matched MP suffix indicates carefully controlled performance parameters.
| Part No. | VRF157FL |
| Manufacturer | MICROSEMI |
| Size | 122 Kbytes |
| Pages | 5 pages |
| Description | RF POWER VERTICAL MOSFET |
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