1. Device Overview & Identification

️· Device Name: HMMC-5023
️· Type: MMIC (Monolithic Microwave Integrated Circuit)
️· Document Status: Typical Performance
️· Wafer Probe Data: Much of the data is from wafer-probed measurements.

2. Operating Conditions & General Information

️· Supply Voltages (VD1 & VD2): 5.0V
️· Ambient Temperature (TA): 25°C (for some tests)
️· Fixture Calibration: Tested on an HP83040 Modular Microcircuit Fixture. Fixture introduces errors requiring compensation.
️· Document Revision: 6-39 (likely a revision number)

3. Performance Characteristics (Summary of Figures - Limited Detail without Visuals)

️· Figure 6. Noise Figure vs. Frequency: A graph showing noise figure (dB) plotted against frequency (GHz) (21 GHz to 25 GHz is visible from the text).
️· Figure 4. Small-Signal Gain vs. Frequency and Ambient Temperature: A graph showing small-signal gain plotted against frequency, with lines showing gain at different temperatures (-15°C to +30°C). 21 GHz to 23 GHz is visible.
️· Figure 7. Gain Compression and Efficiency Characteristics: A graph showing gain (dB) vs. Output Power (dBm) with lines for efficiency. Shows gain compression.
️· Figure 8. Second Harmonic and Gain Compression Characteristics: Similar to Figure 7, but emphasizing second harmonic performance.
️· Figure 9: Assembly Diagram Examples: Shows different ways to bias the device with diagrams for single supply, custom resistor bias, and a VG2 DC supply.
️· Figure 9a: Single DC Drain Supply: A single DC drain supply

4. Numerical Data Points (Extracted where possible - limited without graphs)

️· Frequency Range (seen in descriptions): Approximately 21 GHz - 25 GHz
️· Supply Voltage (VD1 & VD2): 5.0V
️· Frequency Range for Gain Curve: 21-23 GHz
️· Small-Signal Gain (general description): Showing gain at different temperatures
️· Operating Frequency: 22 GHz

5. Bonding Pad Locations

️· Figure 9: Bonding Pad Locations: See Figure 8 for precise bonding pad locations. (Details not easily extracted). Includes references to pads like RFIN, RFOUT, VD1, VD2, VG2.
️· R(typ.) ≥90 Ω: Typical resistance rating
️· ≥20 pF Capacitor: minimum capacitance

6. Assembly & Biasing Notes

️· Figure 9a - 9c: Examples of assembly and biasing circuits.
- Single DC drain supply
- Custom resistor network to bias output stages.
- VG2 DC supply (optional).
️· Resistive divider network: for custom biasing of output gain stages.

7. Important Notes & Caveats

️· Typical Values: The term "typical" refers to the 50th percentile performance.
️· Fixture Effects: The HP83040 fixture introduces errors.
️· Temperature Coefficient of Noise Figure: 0.003 dB/ ° C at 20 GHz



Limitations and What's Missing:

️· Full Numerical Data: Without the visual graphs, getting complete numerical data for all figures is impossible.
️· Detailed Pad Layout: The bonding pad layout description is insufficient for detailed design.
️· Specific Specifications: Many specific technical specifications (e.g., exact noise figure values at certain frequencies) are missing.
️· Bonding pad specifications: detailed specifications.