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HMMC-5023 Datenblatt(PDF) 1 Page - Agilent(Hewlett-Packard)

Teilenummer HMMC-5023
Bauteilbeschribung  23 GHz LNA (21.2-26.5 GHz)
PDF  6 Pages
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HMMC-5023 Datenblatt(HTML) 1 Page - Agilent(Hewlett-Packard)

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23 GHz LNA
(21.2 – 26.5 GHz)
Technical Data
Features
• Frequency Range:
21 .2 – 23.6 GHz and
24.5 – 26.5 GHz Specified
21– 30 GHz Performance
• Low Noise Temperature:
226 K (2.5 dB N.F.) Typical
• High Gain: 24 dB Typical
• 50
Ω Input/Output Matching
• Single Supply Bias with
Optional Bias Adjust:
5 volts (@ 24 mA Typical)
Description
The HMMC-5023 MMIC is a high-
gain low-noise amplifier (LNA)
that operates from 21 GHz to over
30 GHz. By eliminating the
complex tuning and assembly
processes typically required by
hybrid (discrete-FET) amplifiers,
the HMMC-5023 is a cost-effective
alternative in 21.2 – 23.6 GHz and
24.5 – 26.5 GHz communications
receivers. The device has good
input and output match to
50 ohms and is unconditionally
stable to more than 40 GHz. The
backside of the chip is both RF
and DC ground. This helps
simplify the assembly process
and reduces assembly related
performance variations and costs.
It is fabricated using a PHEMT
integrated circuit structure that
provides exceptional noise and
gain performance.
Absolute Maximum Ratings[1]
Symbol
Parameters/Conditions
Units
Min.
Max.
VD1, VD2
Drain Supply Voltage
V
3
8
VD1, VD2
Gate Supply Voltage
V
0.4
2
ID1
Drain Supply Current
mA
35
ID2
Drain Supply Current
mA
35
Pin
RF Input Power[2]
dBm
15
Tch
Operating Channel Temp.[3]
°C
+150
TA
Backside Ambient Temp.
°C
-55
+140
TSTG
Storage Temperature
°C
-65
+165
Tmax
Maximum Assembly Temp.
°C
+300
Notes:
1. Absolute maximum rating for continuous operation unless otherwise noted.
2. Operating at this power level for extended (continuous) periods is not
recommended.
3. Refer to DC Specifications/Physical Properties table for derating information.
Chip Size:
2980 x 620
µm (74 x 24.4 mils)
Chip Size Tolerance:
± 10µm(± 0.4mils)
Chip Thickness:
127
± 15µm(5.0± 0.6mils)
Pad Dimensions:
80 x 80
µm (3.1 x 3.1 mils), or larger
HMMC-5023
5965-5448E


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