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Hello, Please ask a question about REG5601 Datasheet
# Example questions:
➢ What is the typical thermal shutdown activation temperature for the reg5601, and what is the recommended maximum junction temperature to maintain reliability?
➢ What is the maximum output current the reg5601 can provide, and what happens if this limit is exceeded?
➢ What is their purpose and how do they impact the device's thermal performance?
1. Overview & Function:
️· What it is: The REG5601 is a SCSI termination IC. It's a chip designed to handle the termination requirements of SCSI (Small Computer System Interface) bus systems. This includes providing termination resistance and logic functions.
️· Key Feature: It provides a controlled termination and disconnect function for SCSI bus signals.
2. Electrical Characteristics (Highlights):
️· Termination Impedance: Typically 107-115 Ohms.
️· Output Voltage: 2.8-3.0 Volts (regulated output).
️· Output Current: Up to 1650mA.
️· Current Limit: Approximately 1350mA
️· Drop-Out Voltage: Typically around 1.0-1.2 Volts.
️· Disconnect Logic Input:
- Disconnect Threshold: 0.8 Volts
- Hysteresis: 1.6 Volts
️· Thermal Shutdown: Activates around 175°C.
3. Thermal Considerations & Heat Dissipation:
️· Critical for Performance: Proper heat dissipation is *essential* for reliable operation.
️· Junction-to-Lead & Board-to-Ambient Resistance: The document provides thermal resistance values (θJL, θBA) for various circuit board materials (1-layer, 3-layer, Aluminum) to guide design.
- Lower resistance values are better, meaning more effective heat transfer.
️· Thermal Ground Leads: Crucially, the six thermal ground leads (pins 7, 8, 9, 20, 21, 22) *must* be connected to a large circuit trace to ensure adequate cooling.
️· Testing Method: The document describes a method to verify heat dissipation adequacy by observing the thermal shutdown trigger point.
4. Physical/Package Information:
️· Available in two packages:
- Plastic 28-Lead SOIC (Surface Mount)
- Plastic 28-Lead SSOP (Shrink Small Outline Package)
5. Important Notes & Warnings
️· ESD Sensitivity: The device is sensitive to Electrostatic Discharge (ESD). Appropriate handling precautions are required.
️· Absolute Maximum Ratings: Strict adherence to the "Absolute Maximum Ratings" (voltage, current, power dissipation, temperature) is critical to avoid damage.
️· Life Support Systems: This device is *not* intended for use in life support systems or applications where failure could cause serious harm.
️· Thermal Shutdown: If the device activates thermal shutdown, it indicates insufficient heat dissipation.
6. Application Notes / Figures:
️· Figure 2: Circuit board layout showing importance of grounding thermal leads
️· Figure 1: Shows standard SCSI Termination Application
This summary should give you a good overview of the REG5601 and its key considerations. Do you have any specific questions about a particular aspect of the document?
1. Overview & Function:
️· What it is: The REG5601 is a SCSI termination IC. It's a chip designed to handle the termination requirements of SCSI (Small Computer System Interface) bus systems. This includes providing termination resistance and logic functions.
️· Key Feature: It provides a controlled termination and disconnect function for SCSI bus signals.
2. Electrical Characteristics (Highlights):
️· Termination Impedance: Typically 107-115 Ohms.
️· Output Voltage: 2.8-3.0 Volts (regulated output).
️· Output Current: Up to 1650mA.
️· Current Limit: Approximately 1350mA
️· Drop-Out Voltage: Typically around 1.0-1.2 Volts.
️· Disconnect Logic Input:
- Disconnect Threshold: 0.8 Volts
- Hysteresis: 1.6 Volts
️· Thermal Shutdown: Activates around 175°C.
3. Thermal Considerations & Heat Dissipation:
️· Critical for Performance: Proper heat dissipation is *essential* for reliable operation.
️· Junction-to-Lead & Board-to-Ambient Resistance: The document provides thermal resistance values (θJL, θBA) for various circuit board materials (1-layer, 3-layer, Aluminum) to guide design.
- Lower resistance values are better, meaning more effective heat transfer.
️· Thermal Ground Leads: Crucially, the six thermal ground leads (pins 7, 8, 9, 20, 21, 22) *must* be connected to a large circuit trace to ensure adequate cooling.
️· Testing Method: The document describes a method to verify heat dissipation adequacy by observing the thermal shutdown trigger point.
4. Physical/Package Information:
️· Available in two packages:
- Plastic 28-Lead SOIC (Surface Mount)
- Plastic 28-Lead SSOP (Shrink Small Outline Package)
5. Important Notes & Warnings
️· ESD Sensitivity: The device is sensitive to Electrostatic Discharge (ESD). Appropriate handling precautions are required.
️· Absolute Maximum Ratings: Strict adherence to the "Absolute Maximum Ratings" (voltage, current, power dissipation, temperature) is critical to avoid damage.
️· Life Support Systems: This device is *not* intended for use in life support systems or applications where failure could cause serious harm.
️· Thermal Shutdown: If the device activates thermal shutdown, it indicates insufficient heat dissipation.
6. Application Notes / Figures:
️· Figure 2: Circuit board layout showing importance of grounding thermal leads
️· Figure 1: Shows standard SCSI Termination Application
This summary should give you a good overview of the REG5601 and its key considerations. Do you have any specific questions about a particular aspect of the document?
| Part No. | REG5601 |
| Manufacturer | BURR-BROWN |
| Size | 107 Kbytes |
| Pages | 3 pages |
| Description | 18-LINE SCSI ACTIVE TERMINATOR |
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