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REG5601 Datenblatt(PDF) 2 Page - Burr-Brown (TI) |
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REG5601 Datenblatt(HTML) 2 Page - Burr-Brown (TI) |
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2 / 3 page ![]() ® REG5601 2 SPECIFICATIONS CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS Termpwr Voltage ................................................................................. +7V Signal Line Voltage ................................................................... 0V to +7V Regulator Output Current ................................................................. 1.65A Power Dissipation .............................................................................. 2.5W Operating Junction Temperature ................................... –40 °C to +150°C Storage Temperature ..................................................... –40 °C to +150°C Top View SOIC SSOP REG5601U REG5601E PARAMETERS CONDITIONS MIN TYP MAX MIN TYP MAX UNIT POWER SUPPLY Termpwr Supply Voltage 4.0 5.25 4.0 5.25 V Termpwr Supply Current All Termination Lines = Open 14 25 14 25 mA All VTERM = 0.5V 385 430 385 430 mA Power-Down Mode Disconnect = Open (High) 100 150 100 150 µA TERMINATION LINES Termination Impedance ∆I TERM = 5mA to 15mA 107 110 115 107 110 115.5 Ω Output High Voltage Termpwr = 4V(1) 2.65 2.8 2.65 2.8 V Maximum Output Current VTERM = 0.5V 20.5 21.7 22.4 19.8 21.7 22.4 mA Termpwr = 4V, VTERM = 0.5V(1) 19.4 21 22.4 19 21 22.4 mA Output Clamp Level ITERM = –30mA –0.2 –0.05 0.1 –0.2 –0.05 0.1 V Output Leakage Disconnect = Open (High), Tempwr = 0V to 5.25V 20 400 20 400 nA Output Capacitance Disconnect = Open (High) 10 10 pF REGULATOR Regulator Output Voltage 2.8 2.9 3.0 2.8 2.9 3.0 V Line Regulation Termpwr = 4V to 6V 6 20 6 20 mV Load Regulation IREG = 0 to 400mA 20 50 20 50 mV Drop-Out Voltage All VTERM = 0.5V, ∆VREG = 100mV 1.0 1.2 1.0 1.2 V Short-Circuit Current VREG = 0V 450 1350 1650 450 1350 1650 mA Current Sink VREG = 3.5V 8 11 8 11 mA Thermal Shutdown 170 170 °C DISCONNECT LOGIC INPUT Disconnect Threshold 0.8 1.6 2.0 0.8 1.6 2.0 V Threshold Hysterisis 200 200 mV Input Current (Internal Pull-Up) Disconnect = 0V 6 15 6 15 µA TEMPERATURE RANGE Operating 070 0 70 °C Storage –40 150 –40 150 °C θ JL (junction to lead) 20 20 °C/W NOTE: (1) Measurement of each termination line while the other 17 lines are held low (0.5V). Disconnect Termination Line 1 Termination Line 2 Termination Line 3 Termination Line 4 Termination Line 5 (Thermal) GND (Thermal) GND (Thermal) GND Termination Line 6 Termination Line 7 Termination Line 8 Termination Line 9 Termpwr GND Termination Line 18 Termination Line 17 Termination Line 16 Termination Line 15 Termination Line 14 GND (Thermal) GND (Thermal) GND (Thermal) Termination Line 13 Termination Line 12 Termination Line 11 Termination Line 10 Reg Out 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 REG5601 NOTE: Pin 28 is electrical ground. Connect pins 7, 8, 9, 20, 21, 22 to large circuit trace for proper heat sinking. Connect to ground or leave open-circuit. T A = 0°C to +70°C, Termpwr = 4.75V, and Disconnect = 0V unless otherwise specified. PACKAGE/ORDERING INFORMATION PACKAGE DRAWING MODEL PACKAGE NUMBER(1) REG5601U Plastic 28-Lead SOIC 217 REG5601E Plastic 28-Lead SSOP 324 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. |
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