Applications
■ Techniques
■ Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better contact (wet out) and improved bond strength.
■ To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.
■ Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.