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DSC3001 Datenblatt (PDF) - Micrel Semiconductor

DSC3001 Datasheet PDF - Micrel Semiconductor
Teilenummer DSC3001
Download  DSC3001 Download
Filegröße   477.16 Kbytes
Page   5 Pages
Hersteller  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor
Bauteilbeschribung Low-Power Ultra-Miniature Oscillator

DSC3001 Datasheet (PDF)

Go To PDF Page Download Datenblatt
DSC3001 Datasheet PDF - Micrel Semiconductor

Teilenummer DSC3001
Download  DSC3001 Click to download

Filegröße   477.16 Kbytes
Page   5 Pages
Hersteller  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor
Bauteilbeschribung Low-Power Ultra-Miniature Oscillator

DSC3001 Datenblatt (HTML) - Micrel Semiconductor


DSC3001 Produktdetails

General Description
The DSC3001 is an ultra-miniature, low-profile complete timing solution in a 1.6 x 1.2 mm footprint. The device is available in frequencies from 1 to 150 MHz with frequency stability as high as 10 PPM across temperature ranges up to -40 to +105ºC. The device delivers the jitter and stability performance required by high definition video and audio, media and applications processors, and solid state drives with a low power ultra-miniature configuration.

Features
● Ultra-Miniature, Low Profile Footprint
    o 1.6 x 1.2 mm
● Frequency Range:
    o 1 to 150MHz
● Frequency Stability over Temperature
    o ±10 PPM, ±25 PPM, ±50 PPM
● Operating voltage
    o 1.7 to 3.6V
● Operating Temperature Range
    o Ext. Industrial -40ºC to 105ºC
    o Industrial -40ºC to 85ºC
    o Ext. Commercial -20ºC to 70ºC
● Low Operating and Standby Current
    o 3.0-6.0 mA Operating
    o 0.015 mA Standby
● MIL-STD 883 Shock and Vibration
● Resistant to over 30,000 G
● RoHS, Pb Free, Reach SVHC Compliant
● AEC-Q100 Automobile Qualified

Benefits
● Ultra-miniature footprint with no external components
● High frequency and temp stability
● 20x higher MTBF than Xtal-based XO
● Shock and vibration resistant to 30,000G for mobile and portable applications

Applications
● Imaging, Video, and Audio Modules
● Portable Consumer Electronics and Media Devices
● Tablets and Mobile Internet Devices
● Low Profile Embedded Designs
● Pico and Femto Networking




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