• Ultra compact LLP1006-2M package
• Low package height < 0.4 mm
• 1-line ESD protection
• Working range ± 5.5 V
• Low leakage current < 0.1 μA
• Low load capacitance CD = 10 pF
• ESD immunity acc. IEC 61000-4-2
± 30 kV contact discharge
± 30 kV air discharge
• Soldering can be checked by standard vision inspection,
no X-ray necessary
• Pin plating NiPdAu (e4) no whisker growth