FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass passivated pellet chip junction
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Meets JESD 201 class 2 whisker test
• Wave and reflow solderable
• AEC-Q101 qualified
• Compatible to SOD-123W package case outline or
SOD-123F and SOD-123FL
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

MECHANICAL DATA
Case: SMF (DO-219AB)
Polarity: band denotes cathode end
Weight: approx. 15 mg
Packaging codes / options:
GS18/10K per 13" reel (8 mm tape)
GS08/3K per 7" reel (8 mm tape)
Circuit configuration: single