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CC2651R3SIPA Datenblatt (PDF) - Texas Instruments

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CC2651R3SIPA Datasheet PDF - Texas Instruments
Teilenummer CC2651R3SIPA
Download  CC2651R3SIPA Download
Filegröße   2645.07 Kbytes
Page   68 Pages
Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments
Bauteilbeschribung CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory

CC2651R3SIPA Datasheet (PDF)

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CC2651R3SIPA Datasheet PDF - Texas Instruments

Teilenummer CC2651R3SIPA
Download  CC2651R3SIPA Click to download

Filegröße   2645.07 Kbytes
Page   68 Pages
Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments
Bauteilbeschribung CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory

CC2651R3SIPA Datenblatt (HTML) - Texas Instruments


CC2651R3SIPA Produktdetails

1 Features
Wireless microcontroller
• Powerful 48-MHz Arm® Cortex®-M4 processor
• 352KB flash program memory
• 32KB of ultra-low leakage SRAM
• 8KB of Cache SRAM (Alternatively available as
general-purpose RAM)
• Programmable radio includes support for 2-
(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low
Energy, IEEE 802.15.4 PHY and MAC
• Supports over-the-air upgrade (OTA)
Low power consumption
• MCU consumption:
– 3.60 mA active mode, CoreMark
– 61 μA/MHz running CoreMark
– 0.8 μA standby mode, RTC, 32KB RAM
– 0.1 μA shutdown mode, wake-up on pin
• Radio Consumption:
– 6.8 mA RX
– 7.1 mA TX at 0 dBm
– 9.6 mA TX at +5 dBm
Wireless protocol support
• Zigbee®
• Bluetooth® 5.2 Low Energy
• SimpleLink™ TI 15.4-stack
• Proprietary systems
High performance radio
• -104 dBm for Bluetooth® Low Energy 125-kbps
• Output power up to +5 dBm with temperature
compensation
Regulatory compliance
• Regulatory certification for compliance with
worldwide radio frequency:
– ETSI RED (Europe)
– ISED (Canada)
– FCC (USA)
MCU peripherals
• Digital peripherals can be routed to any GPIO
• Four 32-bit or eight 16-bit general-purpose timers
• 12-bit ADC, 200 kSamples/s, 8 channels
• 8-bit DAC
• Two comparators
• Programmable current source
• UART, SSI, I2C, I2S
• Real-time clock (RTC)
• Integrated temperature and battery monitor
Security enablers
• AES 128-bit cryptographic accelerator
• True random number generator (TRNG)
• Additional cryptography drivers available in
Software Development Kit (SDK)
Development tools and software
• LP-CC2651R3SIPA Development Kit
• SimpleLink™ CC13xx and CC26xx Software
Development Kit (SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.8-V to 3.8-V single supply voltage
• Tj: -40 to +105°C
Package
• 7-mm × 7-mm MOU (32 GPIOs)
• RoHS-compliant package

3 Description
The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting
Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is
based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and
advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical
applications.
The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated
antenna, DCDC components, Balun, and high frequency crystal oscillator.
The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for
multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency
band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive
sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.
The CC2651R3SIPA has a low sleep current of 0.9 μA with RTC and 32KB RAM retention.
TI has a product life cycle policy with a commitment to product longevity and continuity of supply.
The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low
Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU.CC2651R3SIPA
is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options.
The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system
configuration tool supports migration between devices in the portfolio. A comprehensive number of software
stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more
information, visit wireless connectivity.




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Über Texas Instruments


Texas Instruments (TI) ist ein börsennotiertes Unternehmen, das Halbleiter- und Computertechnologieprodukte entwirft und herstellt.

Es wurde 1930 gegründet und hat seinen Hauptsitz in Dallas, Texas.

TI ist weltweit führend bei der Herstellung von integrierten Schaltkreisen analog und digitaler Signalverarbeitung (DSP) sowie eingebettete Prozessoren und andere Mikrocontroller -Produkte.

Das Unternehmen bedient Kunden in einer Vielzahl von Branchen, einschließlich Automobil-, Kommunikations-, Computer-, Industrie- und Unterhaltungselektronik.

Das Produktportfolio von TI umfasst unter anderem Datenkonverter, Verstärker und Komponenten, ICS -Management -ICs, Mikrocontroller, Sensoren und drahtlose Konnektivitätslösungen.

TI engagiert sich für Innovation und Kundenzufriedenheit und hat eine lange Geschichte, um seinen Kunden qualitativ hochwertige, zuverlässige Produkte zu liefern.

Mit dem Fokus auf Nachhaltigkeit und Energieeffizienz ist TI durch ihre Technologie und Produkte positiv auf die Welt ausgewirkt.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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