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R5F52318BDFM Datenblatt (PDF) - Renesas Technology Corp

R5F52318BDFM Datasheet PDF - Renesas Technology Corp
Teilenummer R5F52318BDFM
Download  R5F52318BDFM Download
Filegröße   4008.38 Kbytes
Page   170 Pages
Hersteller  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp
Bauteilbeschribung 54-MHz 32-bit RX MCUs, built-in FPU, 88.56 DMIPS, up to 512-KB flash memory, various communication functions including USB 2.0 full-speed host/function/OTG, CAN, SD hostnterface,serial sound interface, capacitive touch sensing unit,

R5F52318BDFM Datasheet (PDF)

Go To PDF Page Download Datenblatt
R5F52318BDFM Datasheet PDF - Renesas Technology Corp

Teilenummer R5F52318BDFM
Download  R5F52318BDFM Click to download

Filegröße   4008.38 Kbytes
Page   170 Pages
Hersteller  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp
Bauteilbeschribung 54-MHz 32-bit RX MCUs, built-in FPU, 88.56 DMIPS, up to 512-KB flash memory, various communication functions including USB 2.0 full-speed host/function/OTG, CAN, SD hostnterface,serial sound interface, capacitive touch sensing unit,

R5F52318BDFM Datenblatt (HTML) - Renesas Technology Corp


R5F52318BDFM Produktdetails

Features
■ 32-bit RXv2 CPU core
• Max. operating frequency: 54 MHz
Capable of 88.56 DMIPS in operation at 54 MHz
• Enhanced DSP: 32-bit multiply-accumulate and 16-bit
multiply-subtract instructions supported
• Built-in FPU: 32-bit single-precision floating point (compliant to
IEEE754)
• Divider (fastest instruction execution takes two CPU clock cycles)
• Fast interrupt
• CISC Harvard architecture with 5-stage pipeline
• Variable-length instructions, ultra-compact code
• On-chip debugging circuit
• Memory protection unit (MPU) supported
■ Low power design and architecture
• Operation from a single 1.8-V to 5.5-V supply
• RTC capable of operating on the battery backup power supply
• Three low power consumption modes
• Low power timer (LPT) that operates during the software standby state
■ On-chip flash memory for code
• 128- to 512-Kbyte capacities
• On-board or off-board user programming
• Programmable at 1.8 V
• For instructions and operands
■ On-chip data flash memory
• 8 Kbytes (1,000,000 program/erase cycles (typ.))
• BGO (Background Operation)
■ On-chip SRAM, no wait states
• 32- to 64-Kbyte size capacities
■ Data transfer functions
• DMAC: Incorporates four channels
• DTC: Four transfer modes
■ ELC
• Module operation can be initiated by event signals without using
interrupts.
• Linked operation between modules is possible while the CPU is sleeping.
■ Reset and supply management
• Eight types of reset, including the power-on reset (POR)
• Low voltage detection (LVD) with voltage settings
■ Clock functions
• Main clock oscillator frequency: 1 to 20 MHz
• External clock input frequency: Up to 20 MHz
• Sub-clock oscillator frequency: 32.768 kHz
• PLL circuit input: 4 MHz to 12.5 MHz
• On-chip low- and high-speed oscillators, dedicated on-chip low-speed
oscillator for the IWDT
• USB-dedicated PLL circuit: 4, 6, 8, or 12 MHz
54 MHz can be set for the system clock and 48 MHz for the USB clock
• Generation of a dedicated 32.768-kHz clock for the RTC
• Clock frequency accuracy measurement circuit (CAC)
■ Realtime clock
• Adjustment functions (30 seconds, leap year, and error)
• Calendar count mode or binary count mode selectable
• Time capture function
• Time capture on event-signal input through external pins
■ Independent watchdog timer
• 15-kHz on-chip oscillator produces a dedicated clock signal to drive
IWDT operation.
■ Useful functions for IEC60730 compliance
• Self-diagnostic and disconnection-detection assistance functions for
the A/D converter, clock frequency accuracy measurement circuit,
independent watchdog timer, RAM test assistance functions using the
DOC, etc.
■ External address space
• Four CS areas (4 × 16 Mbytes)
• 8- or 16-bit bus space is selectable per area
■ MPC
• Input/output functions selectable from multiple pins




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Über Renesas Technology Corp


Renesas Technology Corp ist ein japanisches Halbleiterunternehmen, das eine breite Palette von Mikrocontrollern, System-auf-Chips sowie Analog- und Stromversorgungsgeräten für verschiedene Anwendungen in den Märkten Automobil-, Industrie- und Verbrauchermärkte bietet.
Das Unternehmen wurde 2010 durch die Fusion der NEC Electronics Corporation und der Renesas Technology Corporation gegründet.
Renesas ist einer der größten Mikrocontroller -Lieferanten der Welt und ist bekannt für sein Fachwissen in der Entwicklung fortschrittlicher Technologien in Bereichen wie dem Internet of Things (IoT), künstlicher Intelligenz (KI) und Automobilelektronik.
Das Unternehmen hat in über 20 Ländern betrieben und seine Produkte werden in einer Vielzahl von Anwendungen verwendet.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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