Features
Automotive compliancy
• AEC-Q100 grade 2 ongoing
• Operating junction temperature: -40°C to 125°C
• ISO26262 compliant to support ASIL B system integration
• Cyber security features
Hybrid 5.1 MP global and rolling shutter features
• 3D stacked sensor 40 nm/65 nm
• 5.1 MP sensor (2560 x 1984)
• 2.25 μm x 2.25 μm BSI (backside illuminated) pixel
• RGB/NIR pixel technology with RGB NIR 4x4 pattern
• Image array size: 5.8 mm x 4.5 mm
• Optical format 1/2.5 inch
• Bare die or OBGA package
Innovative features
• Dual exposure controls (RGB and IR)
• On-chip bayerization ISP (image signal processor)
• On-chip color HDR (high dynamic range) merges
• On-chip NIR smart upscale
• 4 programmable contexts, in a versatile sequence, with up to 32 elements
Interface
• Quad lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane (MIPI CSI-2
copyright© 2005-2010 MIPI alliance, inc. standard for camera serial interface
2 (CSI-2) version 1.0)
• 6 programmable GPIOs (general-purpose input/outputs) to control the LED
(light-emitting diode)
– Output synchronized with sensor integration periods
– PWM (pulse-width modulation) control
• Fast mode plus I²C control interface
Unique imaging performance
• Peak quantum efficiency 25% @ 940 nm
• HDR linear dynamic range up to 100 dB in rolling shutter mode
• Up to 60 frames per second at full resolution
• Ultralow noise