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IMX8MMIEC Datenblatt (PDF) - NXP Semiconductors

IMX8MMIEC Datasheet PDF - NXP Semiconductors
Teilenummer IMX8MMIEC
Download  IMX8MMIEC Download
Filegröße   2755.85 Kbytes
Page   96 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung i.MX 8M Mini Applications Processor Datasheet for Industrial Products

IMX8MMIEC Datasheet (PDF)

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IMX8MMIEC Datasheet PDF - NXP Semiconductors

Teilenummer IMX8MMIEC
Download  IMX8MMIEC Click to download

Filegröße   2755.85 Kbytes
Page   96 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung i.MX 8M Mini Applications Processor Datasheet for Industrial Products

IMX8MMIEC Datenblatt (HTML) - NXP Semiconductors


IMX8MMIEC Produktdetails

Features
- Arm Cortex-A53 MPCore platform
Quad symmetric Cortex-A53 processors
• 32 KB L1 Instruction Cache
• 32 KB L1 Data Cache
• Media Processing Engine (MPE) with NEON technology supporting the Advanced
Single Instruction Multiple Data architecture:
• Floating Point Unit (FPU) with support of the VFPv4-D16 architecture
Support of 64-bit Armv8-A architecture
512 KB unified L2 cache

-Arm Cortex-M4 core platform
Low power microcontroller available for customer application:
• low power standby mode
• IoT features including Weave
• Manage IR or Wireless Remote
Cortex M4 CPU:
• 16 KB L1 Instruction Cache
• 16 KB L1 Data Cache
• 256 KB tightly coupled memory (TCM)

-Connectivity
One PCI Express (PCIe)
• Single lane supporting PCIe Gen2
• Dual mode operation to function as root complex or endpoint
• Integrated PHY interface
• Support L1 low power sub-state
Two USB 2.0 OTG controllers with integrated PHY interfaces:
• Spread spectrum clock support
Three Ultra Secure Digital Host Controller (uSDHC) interfaces:
• MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec
• SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100
MB/sec
• Support for SDXC (extended capacity)
One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),
Ethernet AVB, and IEEE 1588
Four Universal Asynchronous Receiver/Transmitter (UART) modules
Four I2C modules
Three ECSPI modules

-On-chip memory
Boot ROM (256 KB)
On-chip RAM (256 KB + 32 KB)

-GPIO and pin multiplexing
General-purpose input/output (GPIO) modules with interrupt capability
Input/output multiplexing controller (IOMUXC) to provide centralized pad control

-Power management
Temperature sensor with programmable trip points
Flexible power domain partitioning with internal power switches to support efficient
power management

-External memory interface
32/16-bit DRAM interfaces:
• LPDDR4 (up to 1.5 GHz)
• DDR4-2400
• DDR3L-1600
8-bit NAND-Flash, including support for Raw MLC/SLC devices, BCH ECC up to
62-bit, and ONFi3.2 compliance (clock rates up to 100 MHz and data rates up to 200
MB/sec)
eMMC 5.1 Flash (2 interfaces, uSDHC1 and uSDHC3)
SPI NOR Flash (3 interfaces)
FlexSPI with support for XIP (for ME in low-power mode) and parallel read mode of
two identical FLASH devices

-Multimedia
Video Processing Unit:
• 1080p60 VP9 Profile 0, 2 (10-bit)
• 1080p60 HEVC/H.265 Decoder
• 1080p60 AVC/H.264 Baseline, Main, High decoder
• 1080p60 VP8
• 1080p60 AVC/H.264 Encoder
• 1080p60 VP8
• TrustZone support
Graphic Processing Unit:
• GCNanoUltra for 3D acceleration
• GC320 for 2D acceleration
LCDIF Display Controller:
• Support up to 2 layers of overlay
• Support up to 1080p60 display through MIPI DSI
MIPI Interface:
• 4-lane MIPI CSI interface
• 4-lane MIPI DSI interface
Audio:
• S/PDIF input and output, including a new Raw Capture input mode
• Five synchronous audio interface (SAI) modules supporting I2S, AC97, TDM,
codec/DSP, and DSD interfaces, including one SAI with 8 Tx and 8 Rx lanes, one
SAI with 4 Tx and 4 Rx lanes, two SAI with 2 Tx and 2 Rx lanes, and one SAI with
1 Tx and 1Rx lane. Support over 20 channels of audio subject to I/O limitations.
• 8-Channel Pulse Density Modulation (PDM) input

-System debug
Arm CoreSight debug and trace architecture
Trace Port Interface Unit (TPIU) to support off-chip real-time trace
Embedded Trace FIFO (ETF) with 4 KB internal storage to provide trace buffering
Unified trace capability for Quad Cortex-A53 and Cortex-M4 CPUs
Cross Triggering Interface (CTI)
Support for 5-pin (JTAG) debug interface

-Security
Resource Domain Controller (RDC) supports four domains and up to eight regions of
DDR
Arm TrustZone (TZ) architecture:
• Support Arm Cortex-A53 MPCore TrustZone
On-chip RAM (OCRAM) secure region protection using OCRAM controller
High Assurance Boot (HAB)
Cryptographic acceleration and assurance (CAAM) module and Assurance Module:
• Support Widevine and PlayReady content protection
• Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
• Real-time integrity checker (RTIC)
• DRM support for RSA, AES, 3DES, DES
• Side channel attack resistance
• True random number generation (RNG)
• Manufacturing protection support
Secure non-volatile storage (SNVS):
• Secure real-time clock (RTC)
Secure JTAG controller (SJC)




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Über NXP Semiconductors


NXP Semiconductors ist ein öffentlich gehandeltes multinationales Unternehmen, das eine breite Palette von Halbleitern und integrierten Schaltungen für verschiedene Anwendungen entwirft und herstellt, einschließlich Automobil-, Industrie-, Kommunikations- und Verbrauchermärkte.

Das Unternehmen wurde 2006 gegründet und hat seinen Hauptsitz in Eindhoven, Niederlande.

NXP bietet ein breites Produktportfolio an, darunter Mikrocontroller, Mikroprozessoren, sichere Authentifizierungs -ICs, ICs, ICs, RF- und Mikrowellenkomponenten sowie Sensorlösungen.

Die Produkte des Unternehmens sind energieeffizient, sicher und zuverlässig und werden in einer Vielzahl von Anwendungen verwendet, einschließlich Automobilsysteme, industrielle Automatisierung und Steuerung, intelligente Häuser und Gebäude sowie angeschlossene Geräte.

NXP widmet sich der Innovation und der Kundenzufriedenheit und setzt sich dafür ein, den Kunden die besten Halbleiterlösungen zur Verfügung zu stellen, um ihre Bedürfnisse zu erfüllen.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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