Features
 “Always-on” experience with low power
consumption for both accelerometer and gyroscope
 Power consumption: 0.90 mA in combo highperformance
mode
 Smart FIFO up to 4 kbyte based on features set
 Android M compliant
 Hard, soft ironing for external magnetic sensor
corrections
 ±2/±4/±8/±16 g full scale
 ±125/±250/±500/±1000/±2000 dps full scale
 Analog supply voltage: 1.71 V to 3.6 V
 Independent IO supply (1.62 V)
 Compact footprint, 2.5 mm x 3 mm x 0.83 mm
 SPI & I2C serial interface with main processor data
synchronization feature
 Pedometer, step detector and step counter
 Significant motion and tilt function
 Standard interrupts: free-fall, wakeup, 6D/4D
orientation, click and double-click
 Embedded temperature sensor
 ECOPACK®, RoHS and “Green” compliant

Applications
Pedometer, step detector and step counter
Significant motion and tilt functions
Indoor navigation
Tap and double-tap detection
IoT and connected devices
Intelligent power saving for handheld devices
Vibration monitoring and compensation
Free-fall detection
6D orientation detection

Description
The LSM6DS3TR-C is a system-in-package featuring a
3D digital accelerometer and a 3D digital gyroscope
performing at 0.90 mA in high-performance mode and
enabling always-on low-power features for an optimal
motion experience for the consumer.
The LSM6DS3TR-C supports main OS requirements,
offering real, virtual and batch sensors with 4 kbyte for
dynamic data batching.
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
The LSM6DS3TR-C has a full-scale acceleration range
of ±2/±4/±8/±16 g and an angular rate range of
±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the
LSM6DS3TR-C the preferred choice of system
designers for the creation and manufacturing of reliable
products.
The LSM6DS3TR-C is available in a plastic land grid
array (LGA) package.