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MPC750EC/D Datenblatt (PDF) - NXP Semiconductors

MPC750EC/D Datasheet PDF - NXP Semiconductors
Teilenummer MPC750EC/D
Download  MPC750EC/D Download
Filegröße   717.44 Kbytes
Page   44 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung MPC750A RISC Microprocessor Hardware Specifications

MPC750EC/D Datasheet (PDF)

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MPC750EC/D Datasheet PDF - NXP Semiconductors

Teilenummer MPC750EC/D
Download  MPC750EC/D Click to download

Filegröße   717.44 Kbytes
Page   44 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung MPC750A RISC Microprocessor Hardware Specifications

MPC750EC/D Datenblatt (HTML) - NXP Semiconductors


MPC750EC/D Produktdetails

Features
This section summarizes features of the MPC750’s implementation of the PowerPC architecture. Major
features of the MPC750 are as follows:
• Branch processing unit
— Four instructions fetched per clock
— One branch processed per cycle (plus resolving 2 speculations)
— Up to 1 speculative stream in execution, 1 additional speculative stream in fetch
— 512-entry branch history table (BHT) for dynamic prediction
— 64-entry, 4-way set associative branch target instruction cache (BTIC) for eliminating branch
delay slots
• Dispatch unit
— Full hardware detection of dependencies (resolved in the execution units)
— Dispatch two instructions to six independent units (system, branch, load/store, fixed-point unit
1, fixed-point unit 2, or floating-point)
— Serialization control (predispatch, postdispatch, execution serialization)
• Decode
— Register file access
— Forwarding control
— Partial instruction decode
• Load/store unit
— One cycle load or store cache access (byte, half-word, word, double-word)
— Effective address generation
— Hits under misses (one outstanding miss)
— Single-cycle misaligned access within double word boundary
— Alignment, zero padding, sign extend for integer register file
— Floating-point internal format conversion (alignment, normalization)
— Sequencing for load/store multiples and string operations
— Store gathering
— Cache and TLB instructions
— Big- and little-endian byte addressing supported
— Misaligned little-endian support in hardware
• Fixed-point units
— Fixed-point unit 1 (FXU1)—multiply, divide, shift, rotate, arithmetic, logical
— Fixed-point unit 2 (FXU2)—shift, rotate, arithmetic, logical
— Single-cycle arithmetic, shift, rotate, logical
— Multiply and divide support (multi-cycle)
— Early out multiply
• Floating-point unit
— Support for IEEE-754 standard single- and double-precision floating-point arithmetic
— 3 cycle latency, 1 cycle throughput, single-precision multiply-add
— 3 cycle latency, 1 cycle throughput, double-precision add
— 4 cycle latency, 2 cycle throughput, double-precision multiply-add
— Hardware support for divide
— Hardware support for denormalized numbers
— Time deterministic non-IEEE mode
• System unit
— Executes CR logical instructions and miscellaneous system instructions
— Special register transfer instructions
• Cache structure
— 32K, 32-byte line, 8-way set associative instruction cache
— 32K, 32-byte line, 8-way set associative data cache
— Single-cycle cache access
— Pseudo-LRU replacement
— Copy-back or write-through data cache (on a page per page basis)
— Supports all PowerPC memory coherency modes
— Non-blocking instruction and data cache (one outstanding miss under hits)
— No snooping of instruction cache
• Memory management unit
— 128 entry, 2-way set associative instruction TLB
— 128 entry, 2-way set associative data TLB
— Hardware reload for TLBs
— 4 instruction BATs and 4 data BATs
— Virtual memory support for up to 4 exabytes (252) of virtual memory
— Real memory support for up to 4 gigabytes (232) of physical memory
• Level 2 (L2) cache interface (not implemented on MPC740)
— Internal L2 cache controller and 4K-entry tags; external data SRAMs
— 256K, 512K, and 1 Mbyte 2-way set associative L2 cache support
— Copy-back or write-through data cache (on a page basis, or for all L2)
— 64-byte (256K/512K) and 128-byte (1-Mbyte) sectored line size
— Supports flow-through (reg-buf) synchronous burst SRAMs, pipelined (reg-reg) synchronous
burst SRAMs, and pipelined (reg-reg) late-write synchronous burst SRAMs
— Core-to-L2 frequency divisors of ÷1, ÷1.5, ÷2, ÷2.5, and ÷3 supported
• Bus interface
— Compatible with 60x processor interface
— 32-bit address bus
— 64-bit data bus
— Bus-to-core frequency multipliers of 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x
supported
• Integrated power management
— Low-power 2.6/3.3-volt design
— Three static power saving modes: doze, nap, and sleep
• Integrated Thermal Management Assist Unit
— On-chip thermal sensor and control logic
— Thermal Management Interrupt for software regulation of junction temperature.
• Testability
— LSSD scan design
— JTAG interface
• Reliability and serviceability—Parity checking on 60x and L2 cache buses




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Über NXP Semiconductors


NXP Semiconductors ist ein öffentlich gehandeltes multinationales Unternehmen, das eine breite Palette von Halbleitern und integrierten Schaltungen für verschiedene Anwendungen entwirft und herstellt, einschließlich Automobil-, Industrie-, Kommunikations- und Verbrauchermärkte.

Das Unternehmen wurde 2006 gegründet und hat seinen Hauptsitz in Eindhoven, Niederlande.

NXP bietet ein breites Produktportfolio an, darunter Mikrocontroller, Mikroprozessoren, sichere Authentifizierungs -ICs, ICs, ICs, RF- und Mikrowellenkomponenten sowie Sensorlösungen.

Die Produkte des Unternehmens sind energieeffizient, sicher und zuverlässig und werden in einer Vielzahl von Anwendungen verwendet, einschließlich Automobilsysteme, industrielle Automatisierung und Steuerung, intelligente Häuser und Gebäude sowie angeschlossene Geräte.

NXP widmet sich der Innovation und der Kundenzufriedenheit und setzt sich dafür ein, den Kunden die besten Halbleiterlösungen zur Verfügung zu stellen, um ihre Bedürfnisse zu erfüllen.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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