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FS2305B Datenblatt (PDF) - NXP Semiconductors

FS2305B Datasheet PDF - NXP Semiconductors
Teilenummer FS2305B
Download  FS2305B Download
Filegröße   2461.49 Kbytes
Page   230 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers

FS2305B Datasheet (PDF)

Go To PDF Page Download Datenblatt
FS2305B Datasheet PDF - NXP Semiconductors

Teilenummer FS2305B
Download  FS2305B Click to download

Filegröße   2461.49 Kbytes
Page   230 Pages
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Bauteilbeschribung Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers

FS2305B Datenblatt (HTML) - NXP Semiconductors


FS2305B Produktdetails

Features and benefits
Operating modes
• Normal mode with all power management and functional safety features available
• Stop mode: Low-power OFF mode with multiple wake-up sources (LPOFF)
• Standby mode: Low-power ON mode with HVBUCK or HVLDO1 active and multiple wake-up sources (LPON)
Power management
• HVBUCK: Synchronous buck converter with integrated FETs. Configurable Normal mode output voltage and LPON mode output voltage
(3.3 V or 5.5 V). Output DC current capability of 600 mA in Normal mode, and 100 mA current capability in Low-power ON mode
• HVLDO1: High-voltage LDO instead of the HVBUCK for MCU supply with selectable output voltage (3.3 V or 5.5 V) and up to 100 mA
DC current capability with internal PMOS and 250 mA with external PNP
• HVLDO2: High-voltage LDO regulator for system loads, with optional external protection for off-board sensors, selectable output voltage
(3.3 V or 5.0 V) and up to 100 mA DC current capability
• HVLDO3: High-voltage LDO regulator for CAN FD block supply or other with selectable output voltage (3.3 V or 5.0 V) and up to 150
mA current capability
System features
• One CAN FD supporting up to 5 Mbps communication following ISO 11898-2:2016 and SAE J2284 standards
• One LIN following LIN 2.2, ISO 17987-4 and SAE-J2602-2 standards
• Two wake-up inputs (40 V capable)
• Two high-voltage I/Os with wake-up capability (40 V capable)
• Up to four low-voltage I/Os with wake-up capability
• Four configurable high-side drivers with 150 mA drive capability, to supply LEDs or enable external devices (INH), and cyclic-sense
capability
• Multiple wake-up sources: WAKE pins, HVIO pins, LVIO pins, CAN FD, LIN or dedicated SPI / I2C command
• Device control via 32 bits SPI interface or via I2C interface, with CRC
• Integrated long duration timer (LDT) for system shutdown and wake-up control, programmable up to 194 days
• 16-channel analog multiplexer (AMUX) for system monitoring (temperature, battery voltage, internal voltages)
Functional safety
• Developed following ISO 26262:2018 standard to fit for ASIL B applications
• Internal monitoring circuitry with its own reference
• Additional input for external voltage monitoring
• Window or timeout watchdog function to monitor the MCU failures by software
• FCCU inputs to monitor MCU failures by hardware
• Analog built-in self-test (ABIST) on demand
• Safety outputs (RSTB, FS0B, LIMP0 and LIMP1/2 with 1.25 Hz or 100 Hz PWM capability)
EMC compliance
• The FS23 EMC tests are performed according to ZVEI Generic IC EMC Test Specification version 2.1 (2017) and FMC1278
Electromagnetic Compatibility Specification for Electrical/Electronic Components and subsystems version 3.0 (2018).
• CAN EMC performances certified against IEC62228-3:2019 and SAE J2962-2:2019
• LIN EMC performances certified against IEC62228-2:2016 and SAE J2962-1:2019
Configuration and enablement
• QFN48EP: QFN 48 pins with exposed pad for optimized thermal management, wettable flanks, 7 x 7 x 0.85 mm, 0.5 mm pitch, 48 pins
• One-time programmable (OTP) memory for scalability, expandability and device customization
• OTP emulation mode for system development and evaluation

Applications
• Body control module
• HVAC
• Lighting
• Steering column lock
• Seat module
• Roof module
• Door control module
• Car access
• Gearshift
• Seat belt pre-tension
• Tail gate
• Alarm




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Über NXP Semiconductors


NXP Semiconductors ist ein öffentlich gehandeltes multinationales Unternehmen, das eine breite Palette von Halbleitern und integrierten Schaltungen für verschiedene Anwendungen entwirft und herstellt, einschließlich Automobil-, Industrie-, Kommunikations- und Verbrauchermärkte.

Das Unternehmen wurde 2006 gegründet und hat seinen Hauptsitz in Eindhoven, Niederlande.

NXP bietet ein breites Produktportfolio an, darunter Mikrocontroller, Mikroprozessoren, sichere Authentifizierungs -ICs, ICs, ICs, RF- und Mikrowellenkomponenten sowie Sensorlösungen.

Die Produkte des Unternehmens sind energieeffizient, sicher und zuverlässig und werden in einer Vielzahl von Anwendungen verwendet, einschließlich Automobilsysteme, industrielle Automatisierung und Steuerung, intelligente Häuser und Gebäude sowie angeschlossene Geräte.

NXP widmet sich der Innovation und der Kundenzufriedenheit und setzt sich dafür ein, den Kunden die besten Halbleiterlösungen zur Verfügung zu stellen, um ihre Bedürfnisse zu erfüllen.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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