CPGA Datenblatt(PDF) - Amkor Technology

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CPGA Datenblatt (PDF) - Amkor Technology

CPGA Datasheet PDF - Amkor Technology


Teilenummer	CPGA

Download	CPGA Download

Filegröße	533.21 Kbytes

Page	1 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Bauteilbeschribung

Ceramic Pin Grid Array Package

CPGA Datasheet (PDF)

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Download Datenblatt

CPGA Datasheet PDF - Amkor Technology


Teilenummer	CPGA

Download	CPGA Click to download

Filegröße	533.21 Kbytes

Page	1 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	Ceramic Pin Grid Array Package

CPGA Datenblatt (HTML) - Amkor Technology

CPGA Datasheet HTML 1Page - Amkor Technology

Ähnliche Teilenummer - CPGA

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
TE Connectivity Ltd	CPG	1Mb / 16P	Passive Components August 2007
Same Sky Devices	CPG-01-N-B	187Kb / 2P	PCB PIN 09/12/2024
	CPG-01-SMT-TR	241Kb / 4P	POGO PIN 09/12/2024
	CPG-01-TH-B	217Kb / 3P	POGO PIN 09/12/2024
	CPG-02-N-B	194Kb / 2P	PCB PIN 09/12/2024

Ähnliche Beschreibung - CPGA

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
National Semiconductor ...	U99A	65Kb / 1P	99 Pin Ceramic Pin Grid Array NS Package Number U99A
	U301A	55Kb / 1P	PIN GRID ARRAY CERAMIC 301 PIN CAVITY DOWN
	MKT-U323A	59Kb / 1P	PIN GRID ARRAY CERAMIC, CAVITY DOWN, 323 PIN
	MKT-UA302A	68Kb / 1P	PIN GRID ARRAY, CERAMIC, 302 PIN, CAVITY DOWN,.200 LG PIN
	UP159A	70Kb / 1P	159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A
	U84C	71Kb / 1P	84 Pin Ceramic Pin Grid Array
	U120A	69Kb / 1P	120 Pin Ceramic Pin Grid Array
fujitsu semiconductor	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Amkor Technology	CLGA	357Kb / 1P	Ceramic Land Grid Array Package
Amkor Technology	PPGA	304Kb / 1P	Plastic Pin Grid Array Package

Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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