CSSOP Datenblatt(PDF) - Amkor Technology

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CSSOP Datenblatt (PDF) - Amkor Technology

CSSOP Datasheet PDF - Amkor Technology


Teilenummer	CSSOP

Download	CSSOP Download

Filegröße	304.39 Kbytes

Page	1 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Bauteilbeschribung

Ceramic Shrink Small Outline Package

CSSOP Datasheet (PDF)

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Download Datenblatt

CSSOP Datasheet PDF - Amkor Technology


Teilenummer	CSSOP

Download	CSSOP Click to download

Filegröße	304.39 Kbytes

Page	1 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	Ceramic Shrink Small Outline Package

CSSOP Datenblatt (HTML) - Amkor Technology

CSSOP Datasheet HTML 1Page - Amkor Technology

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Ähnliche Beschreibung - CSSOP

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
National Semiconductor ...	MTD48	62Kb / 1P	48 Lead Molded Thin Shrink Small Outline Package, JEDEC
STMicroelectronics	TSSO20	57Kb / 4P	20-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSOIC	374Kb / 1P	Ceramic Small Outline Integrated Circuit Package
STMicroelectronics	TSSOP14	58Kb / 4P	14-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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