ETCSP Datenblatt(PDF) - Amkor Technology

Datenblatt-Suchmaschine für elektronische Bauteile

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ETCSP Datenblatt (PDF) - Amkor Technology

ETCSP Datasheet PDF - Amkor Technology


Teilenummer	ETCSP

Download	ETCSP Download

Filegröße	148.67 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Bauteilbeschribung

the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datasheet (PDF)

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Download Datenblatt

ETCSP Datasheet PDF - Amkor Technology


Teilenummer	ETCSP

Download	ETCSP Click to download

Filegröße	148.67 Kbytes

Page	2 Pages

Hersteller	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Bauteilbeschribung	the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datenblatt (HTML) - Amkor Technology

ETCSP Datasheet HTML 1Page - Amkor Technology

ETCSP Datasheet HTML 2Page - Amkor Technology

Ähnliche Teilenummer - ETCSP

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Ähnliche Beschreibung - ETCSP

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
STATS ChipPAC, Ltd.	FBGA	559Kb / 2P	Fine Pitch Ball Grid Array
List of Unclassifed Man...	FL7B5BH	68Kb / 1P	Ball-Grid-Array Thin Film Low-Pass Filter
Yamaichi Electronics Co...	IC264-22501-1	200Kb / 1P	Ball Grid Array (BGA, 1.50mm Pitch)
	IC280-169-127	263Kb / 5P	Ball Grid Array (FBGA / CSP / LGA)
	NP276-11904	738Kb / 11P	Ball Grid Array (BGA, 1.27mm Pitch)
	NP396-500	120Kb / 1P	Shrink Ball Grid Array (1.27mm Pitch)
ATMEL Corporation	AT34C02	496Kb / 21P	Permanent Software Write Protection for the First-half of the Array
KOA Speer Electronics, ...	BR	370Kb / 2P	ball grid array (bga) resistor networks
List of Unclassifed Man...	BL1L5NT250ST1	94Kb / 2P	series, ball-grid-array thin film delay lines
Abracon Corporation	ASCSM	1Mb / 3P	Ball Grid Array Packaging 04.24.14

Über Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.

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