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TSV Datenblatt (PDF) - Amkor Technology

TSV Datasheet PDF - Amkor Technology
Teilenummer TSV
Download  TSV Download
Filegröße   1779.69 Kbytes
Page   5 Pages
Hersteller  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Bauteilbeschribung Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.

TSV Datasheet (PDF)

Go To PDF Page Download Datenblatt
TSV Datasheet PDF - Amkor Technology

Teilenummer TSV
Download  TSV Click to download

Filegröße   1779.69 Kbytes
Page   5 Pages
Hersteller  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Bauteilbeschribung Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.

TSV Datenblatt (HTML) - Amkor Technology




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Über Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Diese Informationen dienen nur zu allgemeinen Informationszwecken. Wir haften nicht für Verluste oder Schäden, die durch die oben genannten Informationen verursacht werden.




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