ExpressLane™ PCI Express to PCI Bridge

Features

ƒ General Features

o Forward and Reverse bridging

o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm)

o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm)

o Low power – 400 milliwatts

o EEPROM configuration option with SPI

o Internal 8Kbyte shared RAM

o 1.5 V core supply voltage

o JTAG

o Four (4) GPIO pins for maximum design flexibility

o Extensive PME support including D0 and D0Active, D1, D2 and D3  Hot and D3Cold

o Lead-free packaging only

o Industrial Temperature: -40 to +85ºC